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參數(shù)資料
| 型號(hào)： | WS512K32N-55H1QA |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CHIP66 |
| 封裝： | CERAMIC, HIP-66 |
| 文件頁數(shù)： | 10/10頁 |
| 文件大?。?/td> | 150K |
| 代理商： | WS512K32N-55H1QA |
9
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WS512K32-XXX
ORDERING INFORMATION
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened -55
°C to +125°C
I = Industrial
-40
°C to 85°C
C = Commercial
0
°C to +70°C
PACKAGE TYPE:
H1 = Ceramic Hex-In-line Package, HIP (Package 400)
G2T = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 509)
G4T = 40mm Low Profile CQFP (Package 502)
G1U = 22.4mm Low Profile CQFP (Package 519)
ACCESS TIME (ns)
IMPROVEMENT MARK:
N = No Connect at pin 21 and 39 in HIP for Upgrades
Blank = Standard Power
L = Low Power Data Retention
ORGANIZATION, 512Kx32
User configurable as 1Mx16 or 2Mx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
W S
512K 32 X - XXX X X X
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS512K32-20G4TQA | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68 |
| WS512K32L-15G2TCA | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CQFP68 |
| WS512K32L-25G4TQ | 512K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68 |
| WS512K32L-35G1UC | 512K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68 |
| WS512K32L-35G2TQA | 512K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS512K32N-70HC | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 70NS, NO CONNECT, 66 PGA 1.185" S - Bulk |
| WS512K32N-70HI | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 70NS, NO CONNECT, 66 PGA 1.185" S - Bulk |
| WS512K32N-85HC | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 85NS, NO CONNECT, 66 PGA 1.185" S - Bulk |
| WS512K32N-85HI | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 85NS, NO CONNECT, 66 PGA 1.185" S - Bulk |
| WS512K32NBV-15 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 3.3V SRAM MODULE |
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