參數(shù)資料
型號(hào): WS512K32NV-70HC
元件分類: SRAM
英文描述: 512K X 32 MULTI DEVICE SRAM MODULE, 70 ns, CHIP66
封裝: CERAMIC, HIP-66
文件頁(yè)數(shù): 7/8頁(yè)
文件大小: 212K
代理商: WS512K32NV-70HC
7
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WS512K32V-XXX
PACKAGE 509: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2T)
0.38 (0.015)
± 0.05 (0.002)
0.27 (0.011)
± 0.04 (0.002)
25.15 (0.990)
± 0.26 (0.010) SQ
1.27 (0.050) TYP
24.03 (0.946)
± 0.26 (0.010)
22.36 (0.880)
± 0.26 (0.010) SQ
20.3 (0.800) REF
4.57 (0.180) MAX
0.19 (0.007)
± 0.06 (0.002)
23.87
(0.940) REF
1.0 (0.040)
± 0.127 (0.005)
0.25 (0.010) REF
1
° / 7°
R 0.25
(0.010)
DETAIL A
SEE DETAIL "A"
Pin 1
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
0.940"
TYP
The WEDC 68 lead G2T CQFP
fills the same fit and function as
the JEDEC 68 lead CQFJ or 68
PLCC. But the G2T has the TCE
and lead inspection advantage of
the CQFP form.
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