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參數(shù)資料
| 型號： | WSE128K16-73H1CA |
| 元件分類： | 存儲器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, CHIP66 |
| 封裝： | CERAMIC, HIP-66 |
| 文件頁數(shù)： | 7/15頁 |
| 文件大小： | 299K |
| 代理商： | WSE128K16-73H1CA |
15
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
WSE128K16-XXX
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
M = Military Screened
-55
°C to +125°C
I = Industrial
-40
°C to +85°C
C = Commercial
0
°C to +70°C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex-In-line Package, HIP (Package 400)
G2T = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 509)
ACCESS TIME (ns)
35 = 35ns SRAM and 150ns EEPROM
42 = 45ns SRAM and 120ns EEPROM
73 = 70ns SRAM and 300ns EEPROM
ORGANIZATION, 128K x 16
EEPROM
SRAM
WHITE ELECTRONIC DESIGNS CORP.
ORDERING INFORMATION
W S E 128K16 - XXX X X X
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WSE128K16-42G2TIA | SPECIALTY MEMORY CIRCUIT, CQFP68 |
| WSE128K16-73H1MA | SPECIALTY MEMORY CIRCUIT, CHIP66 |
| WSE128K16-73H1I | SPECIALTY MEMORY CIRCUIT, CHIP66 |
| WSE128K16-35G2TMA | SPECIALTY MEMORY CIRCUIT, CQFP68 |
| WSE128K16-35H1M | SPECIALTY MEMORY CIRCUIT, CHIP66 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WSE128K16-73H1I | 制造商:Microsemi Corporation 功能描述:128K X 16 MIXED MODULE, 5V, 70NS SRAM, 300NS EEPROM, 66 PGA - Bulk |
| WSE128K16-73H1IA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx16 SRAM/EEPROM MODULE |
| WSE128K16-73H1M | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx16 SRAM/EEPROM MODULE |
| WSE128K16-73H1MA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx16 SRAM/EEPROM MODULE |
| WSE128K16-XG2TX | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM/EEPROM MCP |
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