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參數(shù)資料
| 型號(hào)： | WSF41632-22H2M |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類(lèi)： | 存儲(chǔ)器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, CPGA66 |
| 封裝： | 1.385 X 1.385 INCH, PGA TYPE, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件頁(yè)數(shù)： | 6/14頁(yè) |
| 文件大小： | 591K |
| 代理商： | WSF41632-22H2M |
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WSF41632-22XX
14
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
October, 2002
Rev. 4
PRELIMINARY
White Electronic Designs Corp. reserves the right to change products or specications without notice.
ORDERING INFORMATION
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
M = Military Screened
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H2 = Ceramic Hex In-line Package, HIP (Package 402)
G2T = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 509)
ACCESS TIME (ns)
22 = 25ns SRAM and 120ns FLASH
ORGANIZATION, 128K x 32
Flash PROM
SRAM
WHITE ELECTRONIC DESIGNS CORP.
W S F 41632 - 22 X X X
PACKAGE 402: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H2)
35.2 (1.385) ± 0.38 (0.015) SQ
25.4 (1.0) TYP
15.24 (0.600) TYP
0.76 (0.030) ± 0.1 (0.005)
5.7 (0.223)
MAX
3.81 (0.150)
± 0.1 (0.005)
2.54 (0.100)
TYP
25.4 (1.0) TYP
1.27 (0.050) ± 0.1 (0.005)
1.27 (0.050) TYP DIA
0.46 (0.018) ± 0.05 (0.002) DIA
PIN 1 IDENTIFIER
SQUARE PAD
ON BOTTOM
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WSF41632-22H2MA | 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:128KX32 SRAM & 512Kx32 FLASH MIXED MODULE |
| WSF41632-22H2X | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:SRAM/Flash MCP |
| WSF41632-22XX | 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:128KX32 SRAM & 512Kx32 FLASH MIXED MODULE |
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