
X25F087
6
Figure 5. Sector Program Operation Sequence
Figure 6. Program Status Operation Sequence
32 33 34 35 36 37 38 39
SCK
SI
CS
0
1
2
3
4
5
6
7
8
9
10
SCK
SI
PROGRAM
INSTRUCTION
BYTE ADDRESS
(2 BYTE)
DATA BYTE 1
7
6
5
4
3
2
1
0
CS
40 41 42 43 44 45 46 47
DATA BYTE 2
7
6
5
4
3
2
1
0
DATA BYTE 3
7
6
5
4
3
2
1
0
15 14 13
3
2
1
0
20 21 22 23 24 25 26 27 28 29 30 31
6
5
4
3
2
1
0
7007 FRM 07.1
DATA BYTE 16
1
1
1
1
1
1
1
0
1
2
3
4
5
6
7
8
9
CS
SCK
SI
SO
HIGH IMPEDANCE
PROGRAM STATUS
INSTRUCTION
10 11 12 13 14 15
7007 FRM 08
BLOCK LOCK
PROTECTION BYTE
B
L
1
B
L
0
B
L
2
0
0
0
0
0
ABSOLUTE MAXIMUM RATINGS*
Temperature under Bias...................–65
Storage Temperature........................–65
Voltage on any Pin with
Respect to V
SS
D.C. Output Current..............................................5mA
Lead Temperature
(Soldering, 10 seconds)..............................300
°
°
C to +135
C to +150
°
°
C
C
...................................–1V to +7V
°
C
*COMMENT
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and the functional operation of
the device at these or any other conditions above those
indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating con-
ditions for extended periods may affect device reliability.