11
FN8158.3
February 13, 2008
D.C. Operating Specifications Over the recommended operating conditions unless otherwise specified.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
ICC1
VCC Supply Current
(active)
fSCK = 2.5 MHz, SO = Open, VCC = 5.5V
Other Inputs = VSS
400
A
ICC2
VCC Supply Current
(nonvolatile write)
fSCK = 2.5MHz, SO = Open, VCC = 5.5V
Other Inputs = VSS
15
mA
ISB
VCC Current (standby)
SCK = SI = VSS, Addr. = VSS,
CS = VCC = 5.5V
3A
ILI
Input Leakage Current
VIN = VSS to VCC
10
A
ILO
Output Leakage Current
VOUT = VSS to VCC
10
A
VIH
Input HIGH Voltage
VCC x 0.7
VCC + 1
V
VIL
Input LOW Voltage
-1
VCC x 0.3
V
VOL
Output LOW Voltage
IOL = 3mA
0.4
V
VOH
Output HIGH Voltage
IOH = -1mA, VCC ≥ +3V
VCC - 0.8
V
VOH
Output HIGH Voltage
IOH = -0.4mA, VCC ≤ +3V
VCC - 0.4
V
Endurance and Data Retention
PARAMETER
MIN
UNITS
Minimum Endurance
100,000
Data changes per bit per register
Data Retention
100
years
Capacitance
SYMBOL
TEST
TEST CONDITIONS
MAX
UNITS
Input/Output Capacitance (SI)
VOUT = 0V
8
pF
Output Capacitance (SO)
VOUT = 0V
8
pF
Input Capacitance (A0, CS, WP, HOLD, and SCK)
VIN = 0V
6
pF
Power-up Timing
SYMBOL
PARAMETER
MIN
MAX
UNITS
VCC Power-up Rate
0.2
50
V/ms
Power-up to Initiation of Read Operation
1
ms
Power-up to Initiation of Write Operation
50
ms
NOTES:
10. Limits established by characterization and are not production tested.
11. tPUR and tPUW are the delays required from the time the (last) power supply (VCC-) is stable until the specific instruction can be issued.
12. ESD Rating on RH, RL, RW pins is 1.5kV (HBM, 1.0A leakage maximum), ESD rating on all other pins is 2.0kV.
13. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested.
A.C. Test Conditions
Input Pulse Levels
VCC x 0.1 to VCC x 0.9
Input Rise and Fall Times
10ns
Input and Output Timing Level
VCC x 0.5
X9110