FN8160.3 February 3, 2011 X9116 Package Outline Drawing M8.15 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 2, 11/10 DETAIL "" />
參數(shù)資料
型號: X9116WS8IZ-2.7T1
廠商: Intersil
文件頁數(shù): 8/9頁
文件大小: 0K
描述: IC XDCP 16-TAP 10K CMOS 8-SOIC
標(biāo)準(zhǔn)包裝: 2,500
系列: XDCP™
接片: 16
電阻(歐姆): 10k
電路數(shù): 1
溫度系數(shù): 標(biāo)準(zhǔn)值 ±300 ppm/°C
存儲器類型: 非易失
接口: 3 線串行(芯片選擇,遞增,增/減)
電源電壓: 2.7 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SOIC
包裝: 帶卷 (TR)
8
FN8160.3
February 3, 2011
X9116
Package Outline Drawing
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 2, 11/10
DETAIL "A"
TOP VIEW
INDEX
AREA
12
3
-C-
SEATING PLANE
x 45°
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1982.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index fea-
ture must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the seat-
ing plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
SIDE VIEW “A
SIDE VIEW “B”
1.27 (0.050)
6.20 (0.244)
5.80 (0.228)
4.00 (0.157)
3.80 (0.150)
0.50 (0.20)
0.25 (0.01)
5.00 (0.197)
4.80 (0.189)
1.75 (0.069)
1.35 (0.053)
0.25(0.010)
0.10(0.004)
0.51(0.020)
0.33(0.013)
0.25 (0.010)
0.19 (0.008)
1.27 (0.050)
0.40 (0.016)
1.27 (0.050)
0.200
1
2
3
4
5
6
7
8
TYPICAL RECOMMENDED LAND PATTERN
2.41 (0.095)
0.76 (0.030)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
X9116WS8IZT1 功能描述:IC XDCP 16-TAP 10K CMOS 8-SOIC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 接片:256 電阻(歐姆):100k 電路數(shù):2 溫度系數(shù):標(biāo)準(zhǔn)值 35 ppm/°C 存儲器類型:易失 接口:6 線串行(芯片選擇,遞增,增/減) 電源電壓:2.6 V ~ 5.5 V 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:14-TSSOP 包裝:帶卷 (TR)
X9116WS8T1 功能描述:IC XDCP 16-TAP 10K CMOS 8-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標(biāo)準(zhǔn)包裝:2,500 系列:XDCP™ 接片:256 電阻(歐姆):100k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 ±300 ppm/°C 存儲器類型:非易失 接口:I²C(設(shè)備位址) 電源電壓:2.7 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:14-TSSOP 包裝:帶卷 (TR)
X9116WS8T2 功能描述:IC XDCP 16-TAP 10K CMOS 8-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標(biāo)準(zhǔn)包裝:2,500 系列:XDCP™ 接片:256 電阻(歐姆):100k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 ±300 ppm/°C 存儲器類型:非易失 接口:I²C(設(shè)備位址) 電源電壓:2.7 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:14-TSSOP 包裝:帶卷 (TR)
X9116WS8Z 功能描述:數(shù)字電位計(jì) IC CMOS XDCP 10KOHM 16 TAPS 8LD RoHS:否 制造商:Maxim Integrated 電阻:200 Ohms 溫度系數(shù):35 PPM / C 容差:25 % POT 數(shù)量:Dual 每 POT 分接頭:256 弧刷存儲器:Volatile 緩沖刷: 數(shù)字接口:Serial (3-Wire, SPI) 描述/功能:Dual Volatile Low Voltage Linear Taper Digital Potentiometer 工作電源電壓:1.7 V to 5.5 V 電源電流:27 uA 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFN-16 封裝:Reel
X9116WS8Z-2.7 功能描述:IC XDCP 16-TAP 10K CMOS 8-SOIC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 接片:256 電阻(歐姆):100k 電路數(shù):2 溫度系數(shù):標(biāo)準(zhǔn)值 35 ppm/°C 存儲器類型:易失 接口:6 線串行(芯片選擇,遞增,增/減) 電源電壓:2.6 V ~ 5.5 V 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:14-TSSOP 包裝:帶卷 (TR)