VCC
參數(shù)資料
型號(hào): X9258TS24-2.7T1
廠商: Intersil
文件頁數(shù): 12/19頁
文件大?。?/td> 0K
描述: IC XDCP QUAD 256TAP 100K 24-SOIC
標(biāo)準(zhǔn)包裝: 1,000
系列: XDCP™
接片: 256
電阻(歐姆): 100k
電路數(shù): 4
溫度系數(shù): 標(biāo)準(zhǔn)值 ±300 ppm/°C
存儲(chǔ)器類型: 非易失
接口: I²C(設(shè)備位址)
電源電壓: 2.7 V ~ 5.5 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 24-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 24-SOIC
包裝: 帶卷 (TR)
2
FN8168.6
December 15, 2011
Ordering Information
PART NUMBER
(Note 2)
PART
MARKING
VCC LIMITS
(V)
POTENTIOMETER
ORGANIZATION
(k)
TEMPERATURE
RANGE
(°C)
PACKAGE
(Pb-free)
PKG.
DWG. #
X9258US24Z (Note 1)
X9258US Z
5 ±10
50
0 to +70
24 Ld SOIC (300 mil)
M24.3
X9258US24IZ (Note 1)
X9258US ZI
-40 to +85
24 Ld SOIC (300 mil)
M24.3
X9258UV24IZ
X9258UV ZI
-40 to +85
24 Ld TSSOP (4.4mm)
MDP0044
X9258TS24Z
X9258TS Z
100
0 to +70
24 Ld SOIC (300 mil)
M24.3
X9258TS24IZ (Note 1)
X9258TS ZI
-40 to +85
24 Ld SOIC (300 mil)
M24.3
X9258US24Z-2.7 (Note 1) X9258US ZF
2.7 to 5.5
50
0 to +70
24 Ld SOIC (300 mil)
M24.3
X9258US24IZ-2.7 (Note 1) X9258US ZG
-40 to +85
24 Ld SOIC (300 mil)
M24.3
X9258UV24IZ-2.7
X9258UV ZG
-40 to +85
24 Ld TSSOP (4.4mm)
MDP0044
X9258TS24Z-2.7 (Note 1) X9258TS ZF
100
0 to +70
24 Ld SOIC (300 mil)
M24.3
X9258TS24IZ-2.7 (Note 1) X9258TS ZG
-40 to +85
24 Ld SOIC (300 mil)
M24.3
X9258TV24IZ-2.7
X9258TV ZG
-40 to +85
24 Ld TSSOP (4.4mm)
MDP0044
X9258TV24Z-2.7
X9258TV ZF
0 to +70
24 Ld TSSOP (4.4mm)
MDP0044
NOTES:
1. Add “T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for X9258. For more information on MSL please see tech brief TB363.
X9258
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