參數(shù)資料
型號(hào): X9261US24IZT1
廠商: Intersil
文件頁數(shù): 2/20頁
文件大?。?/td> 0K
描述: IC XDCP DUAL 256TAP 50K 24-SOIC
標(biāo)準(zhǔn)包裝: 1,000
系列: XDCP™
接片: 256
電阻(歐姆): 50k
電路數(shù): 2
溫度系數(shù): 標(biāo)準(zhǔn)值 ±300 ppm/°C
存儲(chǔ)器類型: 非易失
接口: 6 線 SPI(芯片選擇,設(shè)備位址)
電源電壓: 4.5 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 24-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 24-SOIC
包裝: 帶卷 (TR)
10
FN8171.4
October 12, 2006
Table 5. Instruction Set
Note:
1/0 = data is one or zero
INSTRUCTION FORMAT
Read Wiper Counter Register (WCR)
Write Wiper Counter Register (WCR)
Read Data Register (DR)
Instruction
Instruction Set
Operation
I3
I2
I1
I0
RB RA
0
P0
Read Wiper Counter
Register
1
0
1
0
1/0 Read the contents of the Wiper Counter
Register pointed to by P0
Write Wiper Counter
Register
1
0
1
0
1/0 Write new value to the Wiper Counter
Register pointed to by P0
Read Data Register
1
0
1
1/0
0
1/0 Read the contents of the Data Register
pointed to by P0 and RB - RA
Write Data Register
1
0
1/0
0
1/0 Write new value to the Data Register
pointed to by P0 and RB - RA
XFR Data Register to
Wiper Counter Register
1
0
1
1/0
0
1/0 Transfer the contents of the Data Register
pointed to by P0 and RB - RA to its
associated Wiper Counter Register
XFR Wiper Counter
Register to Data Register
1
0
1/0
0
1/0 Transfer the contents of the Wiper Counter
Register pointed to by P0 to the Data
Register pointed to by RB - RA
Global XFR Data Registers
to Wiper Counter Registers
0
1
1/0
0
Transfer the contents of the Data Registers
pointed to by RB - RA of all four pots to their
respective Wiper Counter Registers
Global XFR Wiper Counter
Registers to Data Register
1
0
1/0
0
Transfer the contents of both Wiper Counter
Registers to their respective data Registers
pointed to by RB - RA of all four pots
Increment/Decrement
Wiper Counter Register
0
1
0
1/0 Enable Increment/decrement of the Control
Latch pointed to by P0
CS
Falling
Edge
Device Type
Identifier
Device
Addresses
Instruction
Opcode
WCR
Addresses
Wiper Position
(Sent by X9261 on SO)
CS
Rising
Edge
0 1 0 1 0 0 A1 A0 100 100 0 P0
W
C
R
7
W
C
R
6
W
C
R
5
W
C
R
4
W
C
R
3
W
C
R
2
W
C
R
1
W
C
R
0
CS
Falling
Edge
Device Type
Identifier
Device
Addresses
Instruction
Opcode
WCR
Addresses
Data Byte
(Sent by Host on SI)
CS
Rising
Edge
0 1 0 1 0 0 A1 A0 1 0 1000 0 P0
W
C
R
7
W
C
R
6
W
C
R
5
W
C
R
4
W
C
R
3
W
C
R
2
W
C
R
1
W
C
R
0
CS
Falling
Edge
Device Type
Identifier
Device
Addresses
Instruction
Opcode
DR and WCR
Addresses
Data Byte
(Sent by X9271 on SO)
CS
Rising
Edge
0 10100 A1 A0 1 0 1 1 RB RA 0
P0
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
X9261
相關(guān)PDF資料
PDF描述
VE-BTH-MY-F3 CONVERTER MOD DC/DC 52V 50W
VE-BT4-MY-F1 CONVERTER MOD DC/DC 48V 50W
ISL22429UFU10Z-TK IC POT DGTL 128TP LN LP 10-MSOP
X9261US24ZT1 IC XDCP DUAL 256TAP 50K 24-SOIC
VE-BTH-MY-F2 CONVERTER MOD DC/DC 52V 50W
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
X9261US24T1 功能描述:IC XDCP DUAL 256TAP 50K 24-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標(biāo)準(zhǔn)包裝:2,500 系列:XDCP™ 接片:256 電阻(歐姆):100k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 ±300 ppm/°C 存儲(chǔ)器類型:非易失 接口:I²C(設(shè)備位址) 電源電壓:2.7 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:14-TSSOP 包裝:帶卷 (TR)
X9261US24Z 功能描述:IC XDCP DUAL 256TAP 50K 24-SOIC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 接片:32 電阻(歐姆):50k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 50 ppm/°C 存儲(chǔ)器類型:易失 接口:3 線串行(芯片選擇,遞增,增/減) 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-6 細(xì)型,TSOT-23-6 供應(yīng)商設(shè)備封裝:TSOT-23-6 包裝:帶卷 (TR)
X9261US24Z-2.7 功能描述:IC XDCP DUAL 256TAP 50K 24-SOIC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 接片:32 電阻(歐姆):50k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 50 ppm/°C 存儲(chǔ)器類型:易失 接口:3 線串行(芯片選擇,遞增,增/減) 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-6 細(xì)型,TSOT-23-6 供應(yīng)商設(shè)備封裝:TSOT-23-6 包裝:帶卷 (TR)
X9261US24Z-2.7T1 功能描述:IC XDCP DUAL 256TAP 50K 24-SOIC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 接片:32 電阻(歐姆):50k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 50 ppm/°C 存儲(chǔ)器類型:易失 接口:3 線串行(芯片選擇,遞增,增/減) 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-6 細(xì)型,TSOT-23-6 供應(yīng)商設(shè)備封裝:TSOT-23-6 包裝:帶卷 (TR)
X9261US24ZT1 功能描述:IC XDCP DUAL 256TAP 50K 24-SOIC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 接片:32 電阻(歐姆):50k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 50 ppm/°C 存儲(chǔ)器類型:易失 接口:3 線串行(芯片選擇,遞增,增/減) 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-6 細(xì)型,TSOT-23-6 供應(yīng)商設(shè)備封裝:TSOT-23-6 包裝:帶卷 (TR)