VCC LIMITS
參數(shù)資料
型號(hào): X9269TS24I-2.7
廠商: Intersil
文件頁(yè)數(shù): 12/24頁(yè)
文件大小: 0K
描述: IC XDCP DUAL 256TAP 100K 24-SOIC
標(biāo)準(zhǔn)包裝: 30
系列: XDCP™
接片: 256
電阻(歐姆): 100k
電路數(shù): 2
溫度系數(shù): 標(biāo)準(zhǔn)值 ±300 ppm/°C
存儲(chǔ)器類型: 非易失
接口: I²C(設(shè)備位址)
電源電壓: 2.7 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 24-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 24-SOIC
包裝: 管件
2
FN8173.4
April 17, 2007
Ordering Information
PART NUMBER
PART
MARKING
VCC LIMITS
(V)
POTENTIOMETER
ORGANIZATION
(k
Ω)
TEMP
RANGE
(°C)
PACKAGE
PKG.
DWG. #
X9269TS24*
X9269TS
5 ±10%
100
0 to +70
24 Ld SOIC (300 mil)
M24.3
X9269TS24I*
X9269TS I
-40 to +85 24 Ld SOIC (300 mil)
M24.3
X9269TS24IZ* (Note)
X9269TS ZI
-40 to +85 24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9269TS24Z* (Note)
X9269TS Z
0 to +70
24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9269TV24
X9269TV
0 to +70
24 Ld TSSOP (4.4mm)
MDP0044
X9269US24*
X9269US
0 to +70
24 Ld SOIC (300 mil)
M24.3
X9269US24I*
X9269US I
-40 to +85 24 Ld SOIC (300 mil)
M24.3
X9269US24IZ* (Note)
X9269US ZI
-40 to +85 24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9269US24Z* (Note)
X9269US Z
0 to +70
24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9269UV24*
X9269UV
0 to +70
24 Ld TSSOP (4.4mm)
MDP0044
X9269UV24I
X9269UV I
-40 to +85 24 Ld TSSOP (4.4mm)
MDP0044
X9269TS24-2.7*
X9269TS F
2.7 to 5.5
100
0 to +70
24 Ld SOIC (300 mil)
M24.3
X9269TS24I-2.7*
X9269TS G
-40 to +85 24 Ld SOIC (300 mil)
M24.3
X9269TS24IZ-2.7* (Note)
X9269TS ZG
-40 to +85 24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9269TS24Z-2.7* (Note)
X9269TS ZF
0 to +70
24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9269TV24I-2.7
X9269TV G
-40 to +85 24 Ld TSSOP (4.4mm)
MDP0044
X9269TV24IZ-2.7* (Note)
X9269TV ZG
-40 to +85 24 Ld TSSOP (4.4mm)
(Pb-free)
MDP0044
X9269US24-2.7*
X9269US F
50
0 to +70
24 Ld SOIC (300 mil)
M24.3
X9269US24I-2.7*
X9269US G
-40 to +85 24 Ld SOIC (300 mil)
M24.3
X9269US24IZ-2.7* (Note)
X9269US ZG
-40 to +85 24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9269US24Z-2.7* (Note)
X9269US ZF
0 to +70
24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9269UV24-2.7*
X9269UV F
0 to +70
24 Ld TSSOP (4.4mm)
MDP0044
X9269UV24I-2.7*
X9269UV G
-40 to +85 24 Ld TSSOP (4.4mm)
MDP0044
X9269UV24IZ-2.7*
X9269UV ZG
-40 to +85 24 Ld TSSOP (4.4mm)
MDP0044
*Add "T1" suffix for tape and reel.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
X9269
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X9269TS24IT1 功能描述:IC XDCP DUAL 256TAP 100K 24-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標(biāo)準(zhǔn)包裝:2,500 系列:XDCP™ 接片:256 電阻(歐姆):100k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 ±300 ppm/°C 存儲(chǔ)器類型:非易失 接口:I²C(設(shè)備位址) 電源電壓:2.7 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:14-TSSOP 包裝:帶卷 (TR)
X9269TS24IZ 功能描述:IC XDCP DUAL 256TAP 100K 24-SOIC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 接片:32 電阻(歐姆):50k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 50 ppm/°C 存儲(chǔ)器類型:易失 接口:3 線串行(芯片選擇,遞增,增/減) 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-6 細(xì)型,TSOT-23-6 供應(yīng)商設(shè)備封裝:TSOT-23-6 包裝:帶卷 (TR)
X9269TS24IZ-2.7 功能描述:IC XDCP DUAL 256TAP 100K 24-SOIC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 接片:32 電阻(歐姆):50k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 50 ppm/°C 存儲(chǔ)器類型:易失 接口:3 線串行(芯片選擇,遞增,增/減) 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-6 細(xì)型,TSOT-23-6 供應(yīng)商設(shè)備封裝:TSOT-23-6 包裝:帶卷 (TR)
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