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參數(shù)資料
| 型號： | X9269UV24IZ-2.7T1 |
| 廠商： | Intersil |
| 文件頁數(shù)： | 16/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC XDCP DUAL 256TAP 50K 24-TSSOP |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 系列： | XDCP™ |
| 接片： | 256 |
| 電阻（歐姆）： | 50k |
| 電路數(shù)： | 2 |
| 溫度系數(shù)： | 標(biāo)準(zhǔn)值 ±300 ppm/°C |
| 存儲器類型： | 非易失 |
| 接口： | I²C（設(shè)備位址） |
| 電源電壓： | 2.7 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 24-TSSOP |
| 包裝： | 帶卷 (TR) |
23
FN8173.4
April 17, 2007
X9269
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H
0.25(0.010)
B
M
α
M24.3 (JEDEC MS-013-AD ISSUE C)
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.020
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.5985
0.6141
15.20
15.60
3
E
0.2914
0.2992
7.40
7.60
4
e
0.05 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N24
24
7
α
0°
8°
0°
8°
-
Rev. 1 4/06
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| X9269UV24T1 | 功能描述:IC XDCP DUAL 256TAP 50K 24-TSSOP RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標(biāo)準(zhǔn)包裝:2,500 系列:XDCP™ 接片:256 電阻（歐姆）:100k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 ±300 ppm/°C 存儲器類型:非易失 接口:I²C（設(shè)備位址） 電源電壓:2.7 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:14-TSSOP 包裝:帶卷 (TR) |
| X9271 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Single Supply/Low Power/256-Tap/SPI Bus |
| X9271-2.7 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Single Supply/Low Power/256-Tap/SPI Bus |
| X9271TB | 制造商:XICOR 制造商全稱:Xicor Inc. 功能描述:Single Digitally-Controlled (XDCP) Potentiometer |
| X9271TB-2.7 | 制造商:XICOR 制造商全稱:Xicor Inc. 功能描述:Single Digitally-Controlled (XDCP) Potentiometer |
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