參數(shù)資料
型號: X9313ZP-3
廠商: Intersil
文件頁數(shù): 2/12頁
文件大?。?/td> 0K
描述: IC XDCP 32-TAP 1K 3-WIRE 8-DIP
標(biāo)準(zhǔn)包裝: 50
系列: XDCP™
接片: 32
電阻(歐姆): 1k
電路數(shù): 1
溫度系數(shù): 標(biāo)準(zhǔn)值 ±300 ppm/°C
存儲器類型: 非易失
接口: 3 線串行(芯片選擇,遞增,增/減)
電源電壓: 3 V ~ 5.5 V
工作溫度: 0°C ~ 70°C
安裝類型: 通孔
封裝/外殼: 8-DIP(0.300",7.62mm)
供應(yīng)商設(shè)備封裝: 8-PDIP
包裝: 管件
10
FN8177.6
January 15, 2008
X9313
Small Outline Plastic Packages (SOIC)
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H
0.25(0.010)
B
M
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M8.15 (JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N8
8
7
α
-
Rev. 1 6/05
相關(guān)PDF資料
PDF描述
X9313ZP IC XDCP 32-TAP 1K 3-WIRE 8-DIP
X9313ZMT1 IC XDCP 32-TAP 1K 3-WIRE 8-MSOP
M83723/86G1203N CONN PLUG 3POS STRAIGHT W/SCKT
MS27499E24A2P CONN RCPT 100POS BOX MNT W/PINS
MS27497T20B1SA CONN RCPT 79POS WALL MNT W/SCKT
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
X9313ZPI 功能描述:IC XDCP 32-TAP 1K 3-WIRE 8-DIP RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 接片:32 電阻(歐姆):50k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 50 ppm/°C 存儲器類型:易失 接口:3 線串行(芯片選擇,遞增,增/減) 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-6 細(xì)型,TSOT-23-6 供應(yīng)商設(shè)備封裝:TSOT-23-6 包裝:帶卷 (TR)
X9313ZPI3 制造商:XICOR 制造商全稱:Xicor Inc. 功能描述:E2POT⑩ Nonvolatile Digital Potentiometer
X9313ZPI-3 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Digital Potentiometer
X9313ZPIZ 功能描述:IC XDCP 3-WIRE 32-TAP 10K 8-PDIP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 接片:256 電阻(歐姆):100k 電路數(shù):2 溫度系數(shù):標(biāo)準(zhǔn)值 35 ppm/°C 存儲器類型:易失 接口:6 線串行(芯片選擇,遞增,增/減) 電源電壓:2.6 V ~ 5.5 V 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:14-TSSOP 包裝:帶卷 (TR)
X9313ZPM 制造商:XICOR 制造商全稱:Xicor Inc. 功能描述:E2POT⑩ Nonvolatile Digital Potentiometer