參數(shù)資料
型號: X9314WM
廠商: Intersil
文件頁數(shù): 7/9頁
文件大?。?/td> 0K
描述: IC XDCP SGL 32-TAP 10K 8-MSOP
標準包裝: 80
系列: XDCP™
接片: 32
電阻(歐姆): 10k
電路數(shù): 1
溫度系數(shù): 標準值 ±600 ppm/°C
存儲器類型: 非易失
接口: 3 線串行(芯片選擇,遞增,增/減)
電源電壓: 4.5 V ~ 5.5 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 8-TSSOP,8-MSOP(0.118",3.00mm 寬)
供應商設備封裝: 8-MSOP
包裝: 管件
7
FN8178.2
September 5, 2006
X9314
Mini Small Outline Plastic Packages (MSOP)
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane.
Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (0.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums
and
to be determined at Datum plane
.
11. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only.
L
0.25
(0.010)
L1
R1
R
4X
θ
4X
θ
GAUGE
PLANE
SEATING
PLANE
E
E1
N
12
TOP VIEW
INDEX
AREA
-C-
-B-
0.20 (0.008)
A B C
SEATING
PLANE
0.20 (0.008)
C
0.10 (0.004)
C
-A-
-H-
SIDE VIEW
b
e
D
A
A1
A2
-B-
END VIEW
0.20 (0.008)
C D
E1
CL
C
a
- H -
-A -
- B -
- H -
M8.118 (JEDEC MO-187AA)
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.037
0.043
0.94
1.10
-
A1
0.002
0.006
0.05
0.15
-
A2
0.030
0.037
0.75
0.95
-
b
0.010
0.014
0.25
0.36
9
c
0.004
0.008
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.116
0.120
2.95
3.05
4
e
0.026 BSC
0.65 BSC
-
E
0.187
0.199
4.75
5.05
-
L
0.016
0.028
0.40
0.70
6
L1
0.037 REF
0.95 REF
-
N8
8
7
R
0.003
-
0.07
-
R1
0.003
-
0.07
-
05o
15o
5o
15o
-
α
0o
6o
0o
6o
-
Rev. 2 01/03
相關PDF資料
PDF描述
MS27468T25F35SA CONN RCPT 128POS JAM NUT W/SCKT
MS27484E16A6P CONN PLUG 6POS STRAIGHT W/PINS
X9313ZST1 IC XDCP 32-TAP 1K 3-WIRE 8-SOIC
M83723/83W2461N CONN RCPT 61POS WALL MT W/PINS
X9313ZSIT1 IC XDCP 32-TAP 1K 3-WIRE 8-SOIC
相關代理商/技術參數(shù)
參數(shù)描述
X9314WM3 制造商:XICOR 制造商全稱:Xicor Inc. 功能描述:E2POT⑩ Nonvolatile Digital Potentiometer
X9314WM-3 功能描述:IC XDCP SGL 32-TAP 10K 8-MSOP RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:- 接片:32 電阻(歐姆):50k 電路數(shù):1 溫度系數(shù):標準值 50 ppm/°C 存儲器類型:易失 接口:3 線串行(芯片選擇,遞增,增/減) 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-6 細型,TSOT-23-6 供應商設備封裝:TSOT-23-6 包裝:帶卷 (TR)
X9314WM-3T1 功能描述:IC XDCP SGL 32-TAP 10K 8-MSOP RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:- 接片:32 電阻(歐姆):50k 電路數(shù):1 溫度系數(shù):標準值 50 ppm/°C 存儲器類型:易失 接口:3 線串行(芯片選擇,遞增,增/減) 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-6 細型,TSOT-23-6 供應商設備封裝:TSOT-23-6 包裝:帶卷 (TR)
X9314WMI 功能描述:IC XDCP SGL 32-TAP 10K 8-MSOP RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:- 接片:32 電阻(歐姆):50k 電路數(shù):1 溫度系數(shù):標準值 50 ppm/°C 存儲器類型:易失 接口:3 線串行(芯片選擇,遞增,增/減) 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-6 細型,TSOT-23-6 供應商設備封裝:TSOT-23-6 包裝:帶卷 (TR)
X9314WMI3 制造商:XICOR 制造商全稱:Xicor Inc. 功能描述:E2POT⑩ Nonvolatile Digital Potentiometer