All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certificati" />
參數(shù)資料
型號(hào): X9318WS8
廠商: Intersil
文件頁(yè)數(shù): 2/10頁(yè)
文件大?。?/td> 0K
描述: IC XDCP 100-TAP 10K 8-SOIC
標(biāo)準(zhǔn)包裝: 100
系列: XDCP™
接片: 100
電阻(歐姆): 10k
電路數(shù): 1
溫度系數(shù): 標(biāo)準(zhǔn)值 ±300 ppm/°C
存儲(chǔ)器類(lèi)型: 非易失
接口: 3 線(xiàn)串行(芯片選擇,遞增,增/減)
電源電壓: 4.5 V ~ 5.5 V
工作溫度: 0°C ~ 70°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SOIC
包裝: 管件
10
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8184.1
September 14, 2005
PACKAGING INFORMATION
NOTE:
1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH
0.020 (0.51)
0.016 (0.41)
0.150 (3.81)
0.125 (3.18)
0.110 (2.79)
0.090 (2.29)
0.430 (10.92)
0.360 (9.14)
0.300
(7.62) Ref.
Pin 1 Index
0.145 (3.68)
0.128 (3.25)
0.025 (0.64)
0.015 (0.38)
Pin 1
Seating
0.065 (1.65)
0.045 (1.14)
0.260 (6.60)
0.240 (6.10)
0.060 (1.52)
0.020 (0.51)
Typ. 0.010 (0.25)
15°
8-Lead Plastic, DIP, Package Code P8
Half Shoulder Width On
All End Pins Optional
.073 (1.84)
Max.
0.325 (8.25)
0.300 (7.62)
Plane
X9318
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參數(shù)描述
X9318WS8I 功能描述:IC XDCP 100-TAP 10K 8-SOIC RoHS:否 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 接片:32 電阻(歐姆):50k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 50 ppm/°C 存儲(chǔ)器類(lèi)型:易失 接口:3 線(xiàn)串行(芯片選擇,遞增,增/減) 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:SOT-23-6 細(xì)型,TSOT-23-6 供應(yīng)商設(shè)備封裝:TSOT-23-6 包裝:帶卷 (TR)
X9318WS8IT1 功能描述:IC XDCP 100-TAP 10K 8-SOIC RoHS:否 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 接片:32 電阻(歐姆):50k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 50 ppm/°C 存儲(chǔ)器類(lèi)型:易失 接口:3 線(xiàn)串行(芯片選擇,遞增,增/減) 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:SOT-23-6 細(xì)型,TSOT-23-6 供應(yīng)商設(shè)備封裝:TSOT-23-6 包裝:帶卷 (TR)
X9318WS8IZ 功能描述:數(shù)字電位計(jì) IC 100-TAP 10KOHMUP/DWN INTERFA NON-VOLATILE RoHS:否 制造商:Maxim Integrated 電阻:200 Ohms 溫度系數(shù):35 PPM / C 容差:25 % POT 數(shù)量:Dual 每 POT 分接頭:256 弧刷存儲(chǔ)器:Volatile 緩沖刷: 數(shù)字接口:Serial (3-Wire, SPI) 描述/功能:Dual Volatile Low Voltage Linear Taper Digital Potentiometer 工作電源電壓:1.7 V to 5.5 V 電源電流:27 uA 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFN-16 封裝:Reel
X9318WS8IZT1 功能描述:IC XDCP 100-TAP 10K 8-SOIC RoHS:是 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 接片:256 電阻(歐姆):100k 電路數(shù):2 溫度系數(shù):標(biāo)準(zhǔn)值 35 ppm/°C 存儲(chǔ)器類(lèi)型:易失 接口:6 線(xiàn)串行(芯片選擇,遞增,增/減) 電源電壓:2.6 V ~ 5.5 V 工作溫度:-40°C ~ 125°C 安裝類(lèi)型:表面貼裝 封裝/外殼:14-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:14-TSSOP 包裝:帶卷 (TR)
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