3
FN8216.3
February 20, 2008
.
Absolute Maximum Ratings
Thermal Information
All Voltages are Referred to VSS
Temperature Under bias . . . . . . . . . . . . . . . . . . . . .-65°C to +100°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Voltage on Every Pin Except VCC. . . . . . . . . . . . . . . . . -1.0V to +7V
Voltage on VCC Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to 5.5V
DC Output Current at Pin SDA . . . . . . . . . . . . . . . . . . 0mA to 5 mA
DC Output Current at Pins R1, R2, VREF and VSENSE
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.50mA to 1mA
DC Output Current at Pins I1 and I2 . . . . . . . . . . -3.5mA to +3.5mA
Thermal Resistance (Typical, Note
1)θ
JA (°C/W)
14 Lead TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . .
96
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +100°C
Temperature While Writing to Memory . . . . . . . . . . . . 0°C to +70°C
Voltage on VCC Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3V to 5.5V
Voltage on any other Pin . . . . . . . . . . . . . . . . . . . . . . . . . VCC ± 0.3V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty
NOTE:
1.
θ
JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Conditions are as follows, unless otherwise specified. All typical values are for TA = +25°C and 5V at pin VCC.
Maximum and minimum specifications are over the recommended operating conditions. All voltages are
referred to the voltage at pin VSS. All bits in control registers are “0”. 255Ω, 0.1%, resistor connected between
R1 and VSS, and another between R2 and VSS. 400kHz TTL input at SCL. SDA pulled to VCC through an
external 2k
Ω resistor. 2-wire interface in “standby” (see Notes
9 and
10 on
page 5). WP, A0, A1, and A2 floating.
VREF pin unloaded.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Iccstby
Stand-by Current into VCC Pin
R1 and R2 floating, VREF unloaded.
2
mA
Iccfull
Full Operation Current into VCC
Pin
2-wire interface reading from
memory, I1 and I2 both connected to VSS,
DAC input bytes: FFh, VREF unloaded.
15
mA
Iccwrite
Nonvolatile Write Current into
VCC Pin
Average from START condition until tWP
after the STOP condition
WP: VCC, R1 and R2 Floating, VREF
unloaded.
4mA
IPLDN
On-chip Pull-down Current at WP,
A0, A1, and A2
V(WP), V(A0), V(A1), and V(A2) from 0V
to VCC
01
20
A
VILTTL
SCL and SDA, Input Low Voltage
0.8
V
VIHTTL
SCL and SDA, Input High Voltage
2.0
V
IINTTL
SCL and SDA Input Current
Pin voltage between 0 and VCC, and SDA
as an input.
-1
10
A
VOLSDA
SDA Output Low Voltage
I(SDA) = 2mA
0
0.4
V
IOHSDA
SDA Output High Current
V(SDA) = VCC
0
100
A
VILCMOS
WP, A0, A1, and A2 Input Low
Voltage
0
0.2 x VCC
V
VIHCMOS
WP, A0, A1, and A2 Input High
Voltage
0.8 x VCC
VCC
V
VRefout
Output Voltage at VREF at +25°C -20A ≤ I(VREF) ≤ 20A
1.205
1.21
1.215
V
RVREF
VREF Pin Input Resistance
VRM bit = “1”, +25°C
20
40
k
Ω
TCOref
Temperature Coefficient of VREF
Output Voltage
-100
+100
ppm/°C
VRef Range
Voltage Range when VREF is an
Input
1
1.3
V
TSenseRange
Temperature Sensor Range
-40
100
°C
TSenseAccuracy
Temperature Sensor Accuracy
+/-2
°C
X96012