參數(shù)資料
型號: XA3S1000-4FG456Q
廠商: Xilinx Inc
文件頁數(shù): 7/8頁
文件大小: 0K
描述: IC FPGA SPARTAN-3 456FPBGA
標(biāo)準(zhǔn)包裝: 60
系列: Spartan®-3 XA
LAB/CLB數(shù): 1920
邏輯元件/單元數(shù): 17280
RAM 位總計: 442368
輸入/輸出數(shù): 333
門數(shù): 1000000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 125°C
封裝/外殼: 456-BBGA
供應(yīng)商設(shè)備封裝: 456-FBGA
Introduction and Ordering Information
DS314 (v1.3) June 18, 2009
Product Specification
7
R
Pb-Free Packaging
For additional information on Pb-free packaging, see XAPP427: Implementation and Solder Reflow Guidelines for Pb-Free
Packages.
Additional Resources
DS099, Spartan-3 FPGA Family Data Sheet
UG331, Spartan-3 Generation FPGA User Guide
UG332, Spartan-3 Generation Configuration User Guide
Revision History
The following table shows the revision history for this document:
XA3S50 -4 PQ G 208 Q
Device Type
Speed Grade
Temperature Range:
Q-Grade = Automotive Extended (T
J = –40°C to +125°C)
I-Grade = Automotive Industrial (T
J = –40°C to +100°C)
Package Type
Number of Pins
Pb-free
Example:
DS314-1_03_100808
Table 6: Package Types and Number of Pins
Device
Speed Grade
Package Type / Number of Pins
Temperature Range (TJ)
XA3S50
-4
Standard
Performance
VQG100
100-pin Very Thin Quad Flat Pack (VQFP)
I
I-Grade (–40°C to +100°C)
XA3S200
TQG144
144-pin Thin Quad Flat Pack (TQFP)
Q
Q-Grade (–40°C to +125°C)
XA3S400
PQG208
208-pin Plastic Quad Flat Pack (PQFP)
XA3S1000
FTG256
256-ball Fine-Pitch Thin Ball Grid Array
(FTBGA)
XA3S1500
FGG456
456-ball Fine-Pitch Ball Grid Array (FBGA)
FGG676
676-ball Fine-Pitch Ball Grid Array (FBGA)
Date
Version
Description
10/18/04
1.0
Initial Xilinx release.
12/20/04
1.1
Multiple text edits throughout.
10/27/06
1.2
Updated IO standards (Table 2), and link to Spartan-3 Data Sheet, added XA3S1500, TQG144, FGG676,
11/28/06
1.2.1
Changed order of explanations in Table 6 for TQG144 and PQG208.
11/12/07
1.2.2
Changed all values for the Block RAM (bits) column and two values for the XA3S1000 row in Table 1.
01/25/08
1.2.3
Changed XA3S1500 Q-Grade Maximum in Table 5.
06/18/09
1.3
Added UG331 and UG332 to "Additional Resources" section.
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XA3S1000-4FGG456I 功能描述:IC FPGA SPARTAN-3 1M 456-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3 XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S1000-4FGG456Q 功能描述:IC FPGA SPARTAN-3 1M 456-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3 XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S1000-4FTG256I 功能描述:IC FPGA SPARTAN-3 1M 256-FTBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3 XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S1000-4FTG256Q 功能描述:IC FPGA SPARTAN-3 1M 256-FTBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3 XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S100E-4CPG132I 功能描述:IC FPGA SPARTAN-3E 100K 132CSBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)