參數(shù)資料
型號(hào)： XC1701LPCG20C
廠商： Xilinx Inc
文件頁(yè)數(shù)： 4/13頁(yè)
文件大?。?/td> 0K
描述： IC PROM SERIAL 1K 20-PLCC
產(chǎn)品變化通告： Product Discontinuation 28/Jul/2010
標(biāo)準(zhǔn)包裝： 46
可編程類(lèi)型： OTP
存儲(chǔ)容量： 1Mb
電源電壓： 3 V ~ 3.6 V
工作溫度： 0°C ~ 70°C
封裝/外殼： 20-LCC（J 形引線）
供應(yīng)商設(shè)備封裝： 20-PLCC
包裝： 管件
XC1700E, XC1700EL, and XC1700L Series Configuration PROMs
DS027 (v3.5) June 25, 2008
Product Specification
12
R
Marking Information
Due to the small size of the commercial serial PROM packages, the complete ordering part number cannot be marked on
the package. The XC prefix is deleted and the package code is simplified. Device marking is as follows:
Revision History
The following table shows the revision history for this document.
.
Date
Version
Revision
7/14/98
1.1
Major revisions to include the XC1704L, XC1702L, and the XQ1701L devices, packages and operating
conditions. Also revised the timing specifications under "AC Characteristics Over Operating Condition,"
9/8/98
2.0
Revised the marking information for the VQ44. Updated "DC Characteristics Over Operating Condition,"
page 7. Added references to the XC4000XLA and XC4000XV families in "Xilinx FPGAs and Compatible
12/18/98
2.1
Added Virtex FPGAs to "Xilinx FPGAs and Compatible PROMs," page 4. Added the PC44 package for
the XC1702L and XC1704L products.
1/27/99
2.2
Changed Military ICCS.
7/8/99
2.3
Changed ICCS standby on XC1702/XC1704 from 50 μA to 300 μA.
3/30/00
3.0
Combined data sheets XC1700E and XC1700L. Added DS027, removed Military Specs. Added Virtex-
E and EM references.
07/05/00
3.1
Added 4.7K resistor to Figure 2, updated format.
09/07/04
3.2
defining TCCE when cascading, and redrew associated timing diagram.
Notes:
1.
When marking the device number on the EL parts, an X is used in place of an EL.
2.
For XC1700E/EL only.
3.
For XC1700L only.
1701L J C
Operating Range/Processing
C= Commercial (TA = 0° to +70°C)
I = Industrial (TA = –40° to +85°C)
Package Type
P = 8-pin Plastic DIP
H = 8-pin Plastic DIP, Pb-Free
S(2) = 8-pin Plastic Small-Outline Package
O = 8-pin Plastic Small-Outline Package, Pb-Free
V = 8-pin Plastic Small-Outline Thin Package
G = 8-pin Plastic Small-Outline Thin Package, Pb-Free
S(3) = 20-pin Plastic Small-Outline Package
J = 20-pin Plastic Leaded Chip Carrier
E = 20-pin Plastic Leaded Chip Carrier, Pb-Free
VQ44 = 44-pin Plastic Quad Flat Package
PC44 = 44-pin Plastic Chip Carrier
Device Number
1736E
1765E
1765X(1)
17128E
17128X(1)
17256E
17256X(1)
1704L
1702L
1701
1701L
17512L
Product Obsolete or Under Obsolescence
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XC1701LPCG20I 功能描述:IC PROM SERIAL 1K 20-PLCC RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類(lèi)型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件
XC1701LPD8C 功能描述:IC 1 MB 3.3V SER CONF PROM 8-DIP RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類(lèi)型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件
XC1701LPD8I 制造商:Xilinx 功能描述:
XC1701LPDG8C 功能描述:IC PROM SER CONFIG 1M 3.3V 8-DIP RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類(lèi)型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件
XC1701LPDG8I 功能描述:IC PROM SER CONFIG 1M 3.3V 8-DIP RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類(lèi)型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件
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