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參數(shù)資料
| 型號： | XC17S50APD8I |
| 廠商： | Xilinx Inc |
| 文件頁數(shù)： | 8/8頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC PROM SER 50000 I-TEMP 8-DIP |
| 標準包裝： | 50 |
| 可編程類型： | OTP |
| 存儲容量： | 500kb |
| 電源電壓： | 3 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 8-DIP（0.300"，7.62mm） |
| 供應商設備封裝： | 8-PDIP |
| 包裝： | 管件 |
Spartan-II/Spartan-IIE Family OTP Configuration PROMs (XC17S00A)
DS078 (v1.10) June 25, 2007
Product Specification
8
R
Marking Information
Due to the small size of the PROM package, the complete ordering part number cannot be marked on the package. The XC
prefix is deleted and the package code is simplified. Device marking is as follows.
Revision History
The following table shows the revision history for this document.
Date
Revision
09/14/00
1.0
Initial Xilinx release.
11/13/00
1.1
Updated configuration bits.
04/07/01
1.2
Added to features: “Guaranteed 20 year life data retention”, removed “Programming the FPGA with counters”
and related text.
06/20/01
1.3
Revised Figure 1 resistor values to match Spartan-II data sheet.
10/09/01
1.4
Added note for unlisted pins, changed ICCA and ICCS, and added power-on supply requirements and note
regarding power-on reset.
11/15/01
1.5
Updated for Spartan-IIE FPGA family.
06/25/02
1.6
Changed Table 1, page 4.
10/15/02
1.7
Changed Table 1, page 4. Added "Pinout Diagrams," page 2.
11/18/02
1.8
Added XC2S400E and XC2S600E to Compatible FPGAS table. Modified document title.
06/24/05
1.9
Combinations", and "Marking Information" figures. Removed TSOL from the "Absolute Maximum Ratings(1)"
table.
06/25/07
1.10
Updated format.
Added Pb-free (RoHS-compliant) packaging.
Timing diagram removed from Figure 1, page 3.
Part Numbers XC17S200APDG8I, and XC17S200AVOG8I added to "3.3V Valid Ordering Combinations,"
17S15A
V
C
Operating Range/Processing
C=Commercial (TA = 0
° C to +70° C)
I=Industrial (TA = –40
° C to +85° C)
Package Mark
P=8-pin Plastic DIP
V=8-pin Plastic Small-Outline Thin Package
S=20-pin Plastic Small-Outline Package
VQ=44-pin Plastic Quad Flat Package
G=8-pin Plastic Small-Outline Thin Package, Pb free (RoHS compliant)
H=8-pin Plastic DIP, Lead Free
Device Marking
17S15A
17S30A
17S50A
17S100A
17S150A
17S200A
17S300A
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參數(shù)描述 |
|---|---|
| XC17S50APDG8C | 功能描述:IC PROM SER 50K C-TEMP 8-DIP RoHS:是 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產品變化通告:Product Discontinuation 28/Jul/2010 標準包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:8-TSOP 包裝:管件 |
| XC17S50ASO20C | 功能描述:IC PROM SER 50000 C-TEMP 20-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產品變化通告:Product Discontinuation 28/Jul/2010 標準包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:8-TSOP 包裝:管件 |
| XC17S50ASO20I | 功能描述:IC PROM SER 50000 I-TEMP 20-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產品變化通告:Product Discontinuation 28/Jul/2010 標準包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:8-TSOP 包裝:管件 |
| XC17S50AVO8C | 功能描述:IC PROM SER 500K 8-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產品變化通告:Product Discontinuation 28/Jul/2010 標準包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:8-TSOP 包裝:管件 |
| XC17S50AVO8I | 功能描述:IC PROM SER 500K 8-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產品變化通告:Product Discontinuation 28/Jul/2010 標準包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:8-TSOP 包裝:管件 |
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