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參數(shù)資料
| 型號： | XC18V02PC44C0936 |
| 廠商： | Xilinx Inc |
| 文件頁數(shù)： | 16/24頁 |
| 文件大小： | 0K |
| 描述： | IC PROM SERIAL CONFIG 2M 44-PLCC |
| 標準包裝： | 26 |
| 可編程類型： | 系統(tǒng)內(nèi)可編程 |
| 存儲容量： | 2Mb |
| 電源電壓： | 3 V ~ 3.6 V |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 44-LCC（J 形引線） |
| 供應(yīng)商設(shè)備封裝： | 44-PLCC（16.59x16.59） |
| 包裝： | 管件 |
| 其它名稱： | Q4100865 |
XC18V00 Series In-System-Programmable Configuration PROMs
DS026 (v5.2) January 11, 2008
Product Specification
23
R
Revision History
The following table shows the revision history for this document.
Date
Version
Revision
02/09/99
1.0
First publication of this early access specification
08/23/99
1.1
Edited text, changed marking, added CF and parallel load
09/01/99
1.2
Corrected JTAG order, Security and Endurance data.
09/16/99
1.3
Corrected SelectMAP diagram, control inputs, reset polarity. Added JTAG and CF description,
256 Kbit and 128 Kbit devices.
01/20/00
2.0
Added Q44 Package, changed XC18xx to XC18Vxx
02/18/00
2.1
Updated JTAG configuration, AC and DC characteristics
04/04/00
2.2
Removed stand alone resistor on INIT pin in Figure 5. Added Virtex-E and EM parts to FPGA table.
06/29/00
2.3
Removed XC18V128 and updated format. Added AC characteristics for XC18V01, XC18V512, and
XC18V256 densities.
11/13/00
2.4
Features: changed 264 MHz to 264 Mb/s at 33 MHz; AC Spec.: TSCE units to ns, THCE CE High time
units to
μs. Removed Standby mode statement: “The lower power standby modes available on some
XC18V00 devices are set by the user in the programming software”. Changed 10,000 cycles
endurance to 20,000 cycles.
01/15/01
2.5
Updated Figures 5 and 6, added 4.7 resistors. Identification registers: changes ISP PROM product
ID from 06h to 26h.
04/04/01
2.6
Updated Figure 8, Virtex SelectMAP mode; added XC2V products to Compatible PROM table;
changed Endurance from 10,000 cycles, 10 years to 20,000, 20 years;
04/30/01
2.7
to 25 ns.
06/11/01
2.8
"AC Characteristics Over Operating Conditions for XC18V01 and XC18V512". Changed Min values
for TSCE from 20 ms to 20 ns and for THCE from 2 ms to 2 μs.
09/28/01
2.9
Changed the Boundary-Scan order for the CEO pin in Table 1, updated the configuration bits values
in the table under "Xilinx FPGAs and Compatible PROMs", and added information to the
11/12/01
3.0
Updated for Spartan-IIE FPGA family.
12/06/01
3.1
Changed Figure 5(c).
02/27/02
3.2
03/15/02
3.3
03/27/02
3.4
Made changes to pages 1-3, 5, 7-11, 13, 14, and 18. Added new Figure 9 and Figure 9.
06/14/02
3.5
Made additions and changes to Table 2.
07/24/02
3.6
Changed last bullet under Connecting Configuration PROMs, page 9.
09/06/02
3.7
Multiple minor changes throughout, plus the addition of Pinout Diagrams, page 4 and the deletion
of Figure 9.
10/31/02
3.8
Made minor change on Figure 5 (b) and changed orientation of SO20 diagram on page 5.
11/18/02
3.9
Added XC2S400E and XC2S600E to Table 2.
04/17/03
3.10
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| XC18V02PC44I | 功能描述:IC PROM SER I-TEMP 3.3V 44-PLCC RoHS:否 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標準包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件 |
| XC18V02PCG44C | 功能描述:IC PROM REPROGR 2MB 44-PLCC RoHS:是 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標準包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件 |
| XC18V02SO20 | 制造商:XILINX 制造商全稱:XILINX 功能描述:In-System Programmable Configuration PROMs |
| XC18V02SO20C | 制造商:XILINX 制造商全稱:XILINX 功能描述:In-System Programmable Configuration PROMs |
| XC18V02VQ44 | 制造商:XILINX 制造商全稱:XILINX 功能描述:In-System Programmable Configuration PROMs |
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