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參數(shù)資料
| 型號(hào)： | XC5VFX200T-1FF1738I |
| 廠商： | Xilinx Inc |
| 文件頁(yè)數(shù)： | 10/13頁(yè) |
| 文件大小： | 0K |
| 描述： | IC FPGA VIRTEX-5FXT 1738FFBGA |
| 標(biāo)準(zhǔn)包裝： | 12 |
| 系列： | Virtex®-5 FXT |
| LAB/CLB數(shù)： | 15360 |
| 邏輯元件/單元數(shù)： | 196608 |
| RAM 位總計(jì)： | 16809984 |
| 輸入/輸出數(shù)： | 960 |
| 電源電壓： | 0.95 V ~ 1.05 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | -40°C ~ 100°C |
| 封裝/外殼： | 1738-BBGA，F(xiàn)CBGA |
| 供應(yīng)商設(shè)備封裝： | 1738-FCBGA |
| 配用： | 568-5088-ND - BOARD DEMO DAC1408D750 |
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Virtex-5 Family Overview
6
DS100 (v5.0) February 6, 2009
Product Specification
R
Architectural Description
Virtex-5 FPGA Array Overview
Virtex-5 devices are user-programmable gate arrays with various configurable elements and embedded cores optimized for
high-density and high-performance system designs. Virtex-5 devices implement the following functionality:
I/O blocks provide the interface between package pins
and the internal configurable logic. Most popular and
leading-edge I/O standards are supported by
programmable I/O blocks (IOBs). The IOBs can be
connected to very flexible ChipSync logic for enhanced
source-synchronous interfacing. Source-synchronous
optimizations include per-bit deskew (on both input and
output signals), data serializers/deserializers, clock
dividers, and dedicated I/O and local clocking
resources.
Configurable Logic Blocks (CLBs), the basic logic
elements for Xilinx FPGAs, provide combinatorial and
synchronous logic as well as distributed memory and
SRL32 shift register capability. Virtex-5 FPGA CLBs
are based on real 6-input look-up table technology and
provide superior capabilities and performance
compared to previous generations of programmable
logic.
Block RAM modules provide flexible 36 Kbit true dual-
port RAM that are cascadable to form larger memory
blocks. In addition, Virtex-5 FPGA block RAMs contain
optional programmable FIFO logic for increased device
utilization. Each block RAM can also be configured as
two independent 18 Kbit true dual-port RAM blocks,
providing memory granularity for designs needing
smaller RAM blocks.
Cascadable embedded DSP48E slices with 25 x 18
two’s complement multipliers and 48-bit
adder/subtracter/accumulator provide massively
parallel DSP algorithm support. In addition, each
DSP48E slice can be used to perform bitwise logical
functions.
Clock Management Tile (CMT) blocks provide the most
flexible, highest-performance clocking for FPGAs. Each
CMT contains two Digital Clock Manager (DCM) blocks
(self-calibrating, fully digital), and one PLL block (self-
calibrating, analog) for clock distribution delay
compensation, clock multiplication/division, coarse-
/fine-grained clock phase shifting, and input clock jitter
filtering.
Additionally, LXT, SXT, TXT, and FXT devices also contain:
Integrated Endpoint blocks for PCI Express designs
providing x1, x4, or x8 PCI Express Endpoint
functionality. When used in conjunction with RocketIO
transceivers, a complete PCI Express Endpoint can be
implemented with minimal FPGA logic utilization.
10/100/1000 Mb/s Ethernet media-access control
blocks offer Ethernet capability.
LXT and SXT devices contain:
RocketIO GTP transceivers capable of running up to
3.75 Gb/s. Each GTP transceiver supports full-duplex,
clock-and-data recovery.
TXT and FXT devices contain:
GTX transceivers capable of running up to 6.5 Gb/s.
Each GTX transceiver supports full-duplex, clock-and-
data recovery.
FXT devices contain:
Embedded IBM PowerPC 440 RISC CPUs. Each
PowerPC 440 CPU is capable of running up to
550 MHz. Each PowerPC 440 CPU also has an APU
(Auxiliary Processor Unit) interface that supports
hardware acceleration, and an integrated cross-bar for
high data throughput.
The general routing matrix (GRM) provides an array of
routing switches between each internal component. Each
programmable element is tied to a switch matrix, allowing
multiple connections to the general routing matrix. The
overall programmable interconnection is hierarchical and
designed to support high-speed designs. In Virtex-5
devices, the routing connections are optimized to support
CLB interconnection in the fewest number of “hops.”
Reducing hops greatly increases post place-and-route
(PAR) design performance.
All programmable elements, including the routing
resources, are controlled by values stored in static storage
elements. These values are loaded into the FPGA during
configuration and can be reloaded to change the functions
of the programmable elements.
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| XC5VFX200T-1FFG1738C | 功能描述:IC FPGA VIRTEX 5 200K 1738FFGBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Virtex®-5 FXT 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計(jì):3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA（34.55x34.55） |
| XC5VFX200T-1FFG1738CES | 功能描述:IC FPGA V5 FX ES 200K 1738FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Virtex®-5 FXT 標(biāo)準(zhǔn)包裝:1 系列:Kintex-7 LAB/CLB數(shù):25475 邏輯元件/單元數(shù):326080 RAM 位總計(jì):16404480 輸入/輸出數(shù):350 門數(shù):- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:900-FCBGA（31x31） 其它名稱:122-1789 |
| XC5VFX200T-1FFG1738I | 功能描述:IC FPGA VIRTEX 5 200K 1738FFGBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Virtex®-5 FXT 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計(jì):3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA（34.55x34.55） |
| XC5VFX200T-2FF1738C | 制造商:Xilinx 功能描述:FPGA VIRTEX-5 65NM 1V 1738FCBGA - Trays 制造商:Xilinx 功能描述:IC FPGA VIRTEX5FX 200K 1738BGA 制造商:Xilinx 功能描述:IC FPGA 960 I/O 1738FCBGA |
| XC5VFX200T-2FF1738CES | 功能描述:IC FPGA V5 FX ES 200K 1738FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Virtex®-5 FXT 標(biāo)準(zhǔn)包裝:1 系列:Kintex-7 LAB/CLB數(shù):25475 邏輯元件/單元數(shù):326080 RAM 位總計(jì):16404480 輸入/輸出數(shù):350 門數(shù):- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:900-FCBGA（31x31） 其它名稱:122-1789 |
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