參數(shù)資料
型號(hào)： XC6SLX75T-3FG676I
廠商： Xilinx Inc
文件頁(yè)數(shù)： 11/89頁(yè)
文件大小： 0K
描述： IC FPGA SPARTAN 6 676FGGBGA
標(biāo)準(zhǔn)包裝： 40
系列： Spartan® 6 LXT
LAB/CLB數(shù)： 5831
邏輯元件/單元數(shù)： 74637
RAM 位總計(jì)： 3170304
輸入/輸出數(shù)： 348
電源電壓： 1.14 V ~ 1.26 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 100°C
封裝/外殼： 676-BGA
供應(yīng)商設(shè)備封裝： 676-FBGA（27x27）
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.0) October 17, 2011
Product Specification
19
Switching Characteristics
All values represented in this data sheet are based on these
speed specifications: v1.20 for -3, -3N, and -2; and v1.08 for
-1L. Switching characteristics are specified on a per-speed-
grade basis and can be designated as Advance,
Preliminary, or Production. Each designation is defined as
follows:
Advance
These specifications are based on simulations only and are
typically available soon after device design specifications
are frozen. Although speed grades with this designation are
considered relatively stable and conservative, some under-
reporting might still occur.
Preliminary
These specifications are based on complete ES
(engineering sample) silicon characterization. Devices and
speed grades with this designation are intended to give a
better indication of the expected performance of production
silicon. The probability of under-reporting delays is greatly
reduced as compared to Advance data.
Production
These specifications are released once enough production
silicon of a particular device family member has been
characterized to provide full correlation between
specifications and devices over numerous production lots.
There is no under-reporting of delays, and customers
receive formal notification of any subsequent changes.
Typically, the slowest speed grades transition to Production
before faster speed grades.
All specifications are always representative of worst-case
supply voltage and junction temperature conditions.
Since individual family members are produced at different
times, the migration from one category to another depends
completely on the status of the fabrication process for each
device.
The -1L speed grade refers to the lower-power Spartan-6
devices. The -3N speed grade refers to the Spartan-6
devices that do not support MCB functionality.
Table 26 correlates the current status of each Spartan-6
device on a per speed grade basis.
Testing of Switching Characteristics
All devices are 100% functionally tested. Internal timing parameters are derived from measuring internal test patterns. Listed
below are representative values.
For more specific, more precise, and worst-case guaranteed data, use the values reported by the static timing analyzer and
back-annotate to the simulation net list. Unless otherwise noted, values apply to all Spartan-6 devices.
Table 26: Spartan-6 Device Speed Grade Designations
Device
Speed Grade Designations
Advance
Preliminary
Production
XC6SLX4(1)
-3, -2, -1L
XC6SLX9
-3, -3N, -2, -1L
XC6SLX16
-3, -3N, -2, -1L
XC6SLX25
-3, -3N, -2, -1L
XC6SLX25T
-3, -3N, -2
XC6SLX45
-3, -3N, -2, -1L
XC6SLX45T
-3, -3N, -2
XC6SLX75
-3, -3N, -2, -1L
XC6SLX75T
-3, -3N, -2
XC6SLX100
-3, -3N, -2, -1L
XC6SLX100T
-3, -3N, -2
XC6SLX150
-3, -3N, -2, -1L
XC6SLX150T
-3, -3N, -2
XA6SLX4
-3, -2
XA6SLX9
-3, -2
XA6SLX16
-3, -2
XA6SLX25
-3, -2
XA6SLX25T
-3, -2
XA6SLX45
-3, -2
XA6SLX45T
-3, -2
XA6SLX75
-3, -2
XA6SLX75T
-3, -2
XA6SLX100
-2
XQ6SLX75
-2, -1L
XQ6SLX75T
-3, -2
XQ6SLX150
-2, -1L
XQ6SLX150T
-3, -2
Notes:
1.
The XC6SLX4 is not available in the -3N speed grade.
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XC6SLX75T-3FGG484C 功能描述:IC FPGA SPARTAN 6 74K 484FGGBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:Spartan® 6 LXT 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門(mén)數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC6SLX75T-3FGG484I 功能描述:IC FPGA SPARTAN 6 74K 484FGGBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:Spartan® 6 LXT 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門(mén)數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC6SLX75T-3FGG676C 功能描述:IC FPGA SPARTAN 6 74K 676FGGBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:Spartan® 6 LXT 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門(mén)數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC6SLX75T-3FGG676I 功能描述:IC FPGA SPARTAN 6 74K 676FGGBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:Spartan® 6 LXT 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門(mén)數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC6SLX75T-4CSG484C 功能描述:IC FPGA SPARTAN 6 74K 484CSGBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:Spartan® 6 LXT 標(biāo)準(zhǔn)包裝:1 系列:Kintex-7 LAB/CLB數(shù):25475 邏輯元件/單元數(shù):326080 RAM 位總計(jì):16404480 輸入/輸出數(shù):350 門(mén)數(shù):- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:900-FCBGA（31x31） 其它名稱:122-1789
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