參數(shù)資料
型號: XC6VCX75T-2FFG784C
廠商: Xilinx Inc
文件頁數(shù): 38/52頁
文件大小: 0K
描述: IC FPGA VIRTEX 6 74K 784FFGBGA
產(chǎn)品培訓模塊: Virtex-6 FPGA Overview
產(chǎn)品變化通告: Virtex-6 FIFO Input Logic Reset 18/Apr/2011
標準包裝: 1
系列: Virtex® 6 CXT
LAB/CLB數(shù): 5820
邏輯元件/單元數(shù): 74496
RAM 位總計: 5750784
輸入/輸出數(shù): 360
電源電壓: 0.95 V ~ 1.05 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 784-BBGA,F(xiàn)CBGA
供應商設備封裝: 784-FCBGA
Virtex-6 CXT Family Data Sheet
DS153 (v1.6) February 11, 2011
Product Specification
43
BPI Master Flash Mode Programming Switching
TBPICCO(2)
ADDR[25:0], RS[1:0], FCS_B, FOE_B, FWE_B outputs
valid after CCLK rising edge at 2.5V
66
ns
ADDR[25:0], RS[1:0], FCS_B, FOE_B, FWE_B outputs
valid after CCLK rising edge at 1.8V
66
ns
TBPIDCC/TBPICCD
Setup/Hold on D[15:0] data input pins
4.0/0.0
ns
TINITADDR
Minimum period of initial ADDR[25:0] address cycles
3
CCLK cycles
SPI Master Flash Mode Programming Switching
TSPIDCC/TSPIDCCD
DIN Setup/Hold before/after the rising CCLK edge
3.0/0.0
ns
TSPICCM
MOSI clock to out at 2.5V
6
ns
MOSI clock to out at 1.8V
6
ns
TSPICCFC
FCS_B clock to out at 2.5V
6
ns
FCS_B clock to out at 1.8V
6
ns
TFSINIT/TFSINITH
FS[2:0] to INIT_B rising edge Setup and Hold
2
s
CCLK Output (Master Modes)
TMCCKL
Master CCLK clock Low time duty cycle
45/55
%, Min/Max
TMCCKH
Master CCLK clock High time duty cycle
45/55
%, Min/Max
CCLK Input (Slave Modes)
TSCCKL
Slave CCLK clock minimum Low time
2.5
ns, Min
TSCCKH
Slave CCLK clock minimum High time
2.5
ns, Min
Dynamic Reconfiguration Port (DRP) for MMCM Before and After DCLK
FDCK
Maximum frequency for DCLK
200
MHz
TMMCMDCK_DADDR/
TMMCMCKD_DADDR
DADDR Setup/Hold
1.63/0.00 1.63/0.00
ns
TMMCMDCK_DI/TMMCMCKD_DI
DI Setup/Hold
1.63/0.00 1.63/0.00
ns
TMMCMDCK_DEN/TMMCMCKD_DEN
DEN Setup/Hold time
1.63/0.00 1.63/0.00
ns
TMMCMDCK_DWE/TMMCMCKD_DWE
DWE Setup/Hold time
1.63/0.00 1.63/0.00
ns
TMMCMCKO_DO
CLK to out of DO(3)
3.64
ns
TMMCMCKO_DRDY
CLK to out of DRDY
0.38
ns
Notes:
1.
To support longer delays in configuration, use the design solutions described in Virtex-6 FPGA Configuration Guide.
2.
Only during configuration, the last edge is determined by a weak pull-up/pull-down resistor in the I/O.
3.
DO will hold until next DRP operation.
Table 52: Configuration Switching Characteristics (Cont’d)
Symbol
Description
Speed Grade
Units
-2
-1
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