參數(shù)資料
型號: XM1006-BD
廠商: Mimix Broadband, Inc.
英文描述: 13.0-25.0 GHz GaAs MMIC Image Reject Mixer
中文描述: 13.0-25.0 GHz的砷化鎵微波單片集成電路圖像抑制混頻器
文件頁數(shù): 4/6頁
文件大?。?/td> 325K
代理商: XM1006-BD
IF1
LO
IF2
RF
2
3
1
4
2
2.500
(0.098)
1.885
(0.074)
0.0
0.0
1.424
(0.056)
2.100
(0.083)
1.250
(0.049)
1.424
(0.056)
3
1
4
Mechanical Drawing
(Note: Engineering designator is 18KWR0327)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.25 mg.
Bond Pad #1 (RF)
Bond Pad #2 (IF1)
Bond Pad #3 (LO)
Bond Pad #4 (IF2)
RF Arrangement
Page 4 of 6
13.0-25.0 GHz GaAs MMIC
Image Reject Mixer
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
M1006-BD
February 2007 - Rev 26-Feb-07
XM1006-BD
XM1006-BD
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