參數(shù)資料
型號(hào)： XP1003
廠商： Mimix Broadband, Inc.
英文描述： 27.0-35.0 GHz GaAs MMIC Power Amplifier
中文描述： 27.0-35.0 GHz的砷化鎵單片功率放大器
文件頁(yè)數(shù)： 3/6頁(yè)
文件大?。?/td> 1576K
代理商： XP1003
RF Out
RF In
Vd1,2
Vg1,2
V
OUT
1
V
IN
V
OUT
2
Vd3,4
Vg3,4
Rin
1
2
3
4
5
6
7
8
10
9
13
12
11
1
2
3
4
5
2.500
(0.098)
1.757
(0.069)
0.677
(0.027)
0.0
0.0
0.765
(0.030)
2.157
(0.085)
3.400
(0.134)
6
7
8
1.357
(0.053)
0.957
(0.038)
1.757
(0.069)
1.357
(0.053)
0.957
(0.038)
10
9
13
12
11
2.957
(0.116)
2.557
(0.101)
2.157
(0.085)
2.757
(0.109)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
27.0-35.0 GHz GaAs MMIC
Power Amplifier
Page 3 of 6
Mechanical Drawing
(Note: Engineering designator is 30H2BA0093)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Pads are 0.100 x 0.200 (0.004 x 0.008).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 5.253 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1)
Bond Pad #3 (Vd2)
Bond Pad #6 (V
OUT
1)
Bias Arrangement
Bond Pad #4 (Vg2)
Bond Pad #5 (Vd2)
Bond Pad #7 (V
IN
)
Bond Pad #8 (V
OUT
2)
Bond Pad #9 (RF Out)
Bond Pad #10 (Vd4)
Bond Pad #11 (Vg4)
Bond Pad #12 (Vd3)
Bond Pad #13 (Vg3)
Bypass Capacitors
- See App Note [3]
P1003
May 2005 - Rev 05-May-05
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XP1005 35.0-43.0 GHz GaAs MMIC Power Amplifier
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XP1003-BD 制造商:MIMIX 制造商全稱:MIMIX 功能描述:27.0-35.0 GHz GaAs MMIC
XP1004000-03 功能描述:以太網(wǎng)模塊 XPort-485 w/AES DISC-BY-MFG-05/07 RoHS:否 制造商:Lantronix 產(chǎn)品:Device Servers 數(shù)據(jù)速率:300 bps to 921.6 kbps, 10 Mbps, 100 Mbps 接口類型:Ethernet, Serial 工作電源電壓:5 V to 15 V 工作電源電流:133 mA to 400 mA 最大工作溫度:+ 70 C
XP1004000-03R 功能描述:以太網(wǎng)模塊 XPort RS485 Module Encryp./Ext. Temp. RoHS:否 制造商:Lantronix 產(chǎn)品:Device Servers 數(shù)據(jù)速率:300 bps to 921.6 kbps, 10 Mbps, 100 Mbps 接口類型:Ethernet, Serial 工作電源電壓:5 V to 15 V 工作電源電流:133 mA to 400 mA 最大工作溫度:+ 70 C
XP100400S-03 功能描述:以太網(wǎng)模塊 XPORT-485 SAMPLE PACKAGE W/ CD RoHS:否 制造商:Lantronix 產(chǎn)品:Device Servers 數(shù)據(jù)速率:300 bps to 921.6 kbps, 10 Mbps, 100 Mbps 接口類型:Ethernet, Serial 工作電源電壓:5 V to 15 V 工作電源電流:133 mA to 400 mA 最大工作溫度:+ 70 C
XP100400S-03R 功能描述:以太網(wǎng)模塊 XPort RS485 Sample Package RoHS:否 制造商:Lantronix 產(chǎn)品:Device Servers 數(shù)據(jù)速率:300 bps to 921.6 kbps, 10 Mbps, 100 Mbps 接口類型:Ethernet, Serial 工作電源電壓:5 V to 15 V 工作電源電流:133 mA to 400 mA 最大工作溫度:+ 70 C
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