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參數(shù)資料
| 型號(hào)： | XP1017 |
| 廠商： | Mimix Broadband, Inc. |
| 英文描述： | 30.0-36.0 GHz GaAs MMIC Power Amplifier |
| 中文描述： | 30.0-36.0 GHz的砷化鎵單片功率放大器 |
| 文件頁數(shù)： | 3/6頁 |
| 文件大?。?/td> | 261K |
| 代理商： | XP1017 |
1
2
3
4
5
2.500
(0.098)
1.941
(0.076)
1.851
(0.073)
0.0
0.0
1.710
(0.067)
2.341
(0.092)
6
7
1.541
(0.061)
1.141
(0.045)
1.941
(0.076)
1.541
(0.061)
1.141
(0.045)
11
2.741
(0.108)
10
2.941
(0.116)
3.300
(0.130)
9
8
14
13
12
2.741
(0.108)
2.341
(0.092)
2.941
(0.116)
RF Out
RF In
Vd1,2
Vg1,2
V
DIF
2
V
IN
2
Vd3,4
Vg3,4
1
2
3
4
5
6
7
11
10
9
8
14
13
12
V
DIF
1
V
IN
1
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
Page 3 of 6
Mechanical Drawing
(Note: Engineering designator is 32H2BA0070)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Pads are 0.100 x 0.200 (0.004 x 0.008).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 5.115 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1)
Bond Pad #3 (Vd2)
Bond Pad #6 (V
DIF
1)
Bias Arrangement
Bond Pad #4 (Vg2)
Bond Pad #5 (Vd2)
Bond Pad #7 (V
IN
2)
Bond Pad #8 (RF Out)
Bond Pad #9 (V
IN
1)
Bond Pad #10 (V
DIF
2)
Bond Pad #11 (Vd4)
Bond Pad #12 (Vg4)
Bond Pad #13 (Vd3)
Bond Pad #14 (Vg3)
Bypass Capacitors
- See App Note [3]
30.0-36.0 GHz GaAs MMIC
Power Amplifier
September 2005 - Rev 01-Sep-05
P1017
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| XP1018 | 35.0-45.0 GHz GaAs MMIC Power Amplifier |
| XP1019-BD | 17.0-24.0 GHz GaAs MMIC Power Amplifier |
| XP1019-BD-000X | 17.0-24.0 GHz GaAs MMIC Power Amplifier |
| XP1019-BD-EV1 | 17.0-24.0 GHz GaAs MMIC Power Amplifier |
| XP1020-BD | 11.0-19.0 GHz GaAs MMIC Power Amplifier |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XP1017-BD | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:30.0-36.0 GHz GaAs MMIC |
| XP1017-BD_10 | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:30.0-36.0 GHz GaAs MMIC |
| XP1017-BD-000V | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:30.0-36.0 GHz GaAs MMIC Power Amplifier |
| XP1017-BD-EV1 | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:30.0-36.0 GHz GaAs MMIC Power Amplifier |
| XP1017-V | 制造商:M/A-COM Technology Solutions 功能描述:MMW POWER AMPLIFIER |
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