參數(shù)資料
型號: XP1018
廠商: Mimix Broadband, Inc.
英文描述: 35.0-45.0 GHz GaAs MMIC Power Amplifier
中文描述: 35.0-45.0 GHz的砷化鎵單片功率放大器
文件頁數(shù): 3/6頁
文件大小: 311K
代理商: XP1018
35.0-45.0 GHz GaAs MMIC
Power Amplifier
Page 3 of 6
Mechanical Drawing
Bias Arrangement
Bypass Capacitors
- See App Note [2]
(Note: Engineering designator is 38MPA0630)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.241 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd1)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vd3)
Bond Pad #5 (Vd4)
Bond Pad #6 (RF Out)
Bond Pad #7 (Vg4)
Bond Pad #8 (Vg3)
Bond Pad #9 (Vg2)
Bond Pad #10 (Vg1)
October 2005 - Rev 21-Oct-05
P1018
1.700
(0.067)
1
2
3
4
5
6
7
8
9
10
0.592
(0.023)
0.992
(0.039)
1.392
(0.055)
2.193
(0.086)
1.993
(0.078)
1.392
(0.055)
0.992
(0.039)
0.592
(0.023)
0.0
0.0
1.099
(0.043)
0.639
(0.025)
2.500
(0.098)
1
2
3
4
5
6
7
8
9
10
RF In
Vg1
RF Out
Vg2
Vd1
Vd2
Vd3
Vd4
Vg3
Vg4
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
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