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參數(shù)資料
| 型號： | XP1026-BD-000V |
| 廠商： | MIMIX BROADBAND INC |
| 元件分類： | 衰減器 |
| 英文描述： | 27.0-32.0 GHz GaAs MMIC Power Amplifier |
| 中文描述： | 27000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER |
| 封裝： | ROHS COMPLIANT PACKAGE-14 |
| 文件頁數(shù)： | 3/5頁 |
| 文件大?。?/td> | 294K |
| 代理商： | XP1026-BD-000V |
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RF In
RF Out
Vg3
Vg2
Vg1
Vd1
Vd2
Vd3
2.00
(0.079)
1
2
3
4
5
6
7
8
9
10
11
12
13
0.82
(0.032)
1.22
(0.048)
1.62
(0.064)
2.42
(0.095)
3.22
(0.127)
2.82
(0.111)
2.42
(0.095)
1.62
(0.064)
1.22
(0.048)
0.82
(0.032)
0.0
0.0
1.00
(0.039)
14
2.82
(0.111)
3.22
(0.127)
1.00
(0.039)
3.70
(0.146)
Mechanical Drawing
Bias Arrangement
Bypass Capacitors
- See App Note [2]
(Note: Engineering designator is 30SPA0553)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 4.588 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1A)
Bond Pad #3 (Vd1A)
Bond Pad #4 (Vg2A)
Bond Pad #5 (Vd2A)
Bond Pad #6 (Vg3A)
Bond Pad #7 (Vd3A)
Bond Pad #8 (RF Out)
Bond Pad #9 (Vd3B)
Bond Pad #10 (Vg3B)
Bond Pad #11 Vd2B)
Bond Pad #12 (Vg2B)
Bond Pad #13 (Vd1B)
Bond Pad #14 (Vg1B)
Page 3 of 5
27.0-32.0 GHz GaAs MMIC
Power Amplifier
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
February 2006 - Rev 23-Feb-07
P1026-BD
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| XP1026-BD-EV1 | 27.0-32.0 GHz GaAs MMIC Power Amplifier |
| XP1027-BD | 27.0-33.0 GHz GaAs MMIC Power Amplifier |
| XP1027-BD-000V | 27.0-33.0 GHz GaAs MMIC Power Amplifier |
| XP1027-BD-EV1 | 27.0-33.0 GHz GaAs MMIC Power Amplifier |
| XP1028-BD | 43.5-46.5 GHz GaAs MMIC Power Amplifier |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XP1026-BD-EV1 | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:27.0-32.0 GHz GaAs MMIC Power Amplifier |
| XP1027-BD | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:27.0-31.0 GHz GaAs MMIC |
| XP1027-BD_10 | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:27.0-31.0 GHz GaAs MMIC |
| XP1027-BD-000V | 制造商:M/A-COM TECHNOLOGY SOLUTIONS 功能描述:XP1027-BD-000V,EPOXY,TC,CW |
| XP1027-BD-EV1 | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:27.0-33.0 GHz GaAs MMIC Power Amplifier |
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