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參數(shù)資料
| 型號： | XP1027-BD-000V |
| 廠商： | MIMIX BROADBAND INC |
| 元件分類： | 衰減器 |
| 英文描述： | 27.0-33.0 GHz GaAs MMIC Power Amplifier |
| 中文描述： | 27000 MHz - 31000 MHz RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER |
| 封裝： | ROHS COMPLIANT PACKAGE-14 |
| 文件頁數(shù)： | 3/5頁 |
| 文件大小： | 246K |
| 代理商： | XP1027-BD-000V |
RF In
RF Out
Vg3
Vg2
Vg1
Vd3
Vd2
Vd1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
3.500
(0.138)
1
2
3
4
5
6
7
8
9
10
11
12
13
0.961
(0.038)
1.361
(0.054)
1.761
(0.069)
2.561
(0.101)
3.361
(0.132)
2.961
(0.117)
2.561
(0.101)
1.761
(0.069)
1.361
(0.054)
0.961
(0.038)
0.0
0.0
1.274
(0.050)
14
2.961
(0.117)
3.361
(0.132)
2.226
(0.088)
4.000
(0.158)
27.0-33.0 GHz GaAs MMIC
Power Amplifier
Mechanical Drawing
Bias Arrangement
Bypass Capacitors
- See App Note [2]
(Note: Engineering designator is 30SPA0536)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.004
3
+/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 8.68 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (
V
g1A)
Bond Pad #
3
(
V
d1A)
Bond Pad #4 (
V
g2A)
Bond Pad #5 (
V
d2A)
Bond Pad #6 (
V
g
3
A)
Bond Pad #7 (
V
d
3
A)
Bond Pad #8 (RF Out)
Bond Pad #9 (
V
d
3
B)
Bond Pad #10 (
V
g
3
B)
Bond Pad #11
V
d2B)
Bond Pad #12 (
V
g2B)
Bond Pad #1
3
(
V
d1B)
Bond Pad #14 (
V
g1B)
Page
3
of 5
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
P1027-BD
XP1027-BD
XP1027-BD
March 2007 - Rev 27-Mar-07
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| XP1027-BD-EV1 | 27.0-33.0 GHz GaAs MMIC Power Amplifier |
| XP1028-BD | 43.5-46.5 GHz GaAs MMIC Power Amplifier |
| XP1028-BD-000V | 43.5-46.5 GHz GaAs MMIC Power Amplifier |
| XP1028-BD-EV1 | 43.5-46.5 GHz GaAs MMIC Power Amplifier |
| XP131A1715SR | N-Channel Power MOS FET |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XP1027-BD-EV1 | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:27.0-33.0 GHz GaAs MMIC Power Amplifier |
| XP1027-V | 制造商:M/A-COM Technology Solutions 功能描述:MMW POWER AMPLIFIER |
| XP1028-BD | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:43.5-46.5 GHz GaAs MMIC Power Amplifier |
| XP1028-BD-000V | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:43.5-46.5 GHz GaAs MMIC Power Amplifier |
| XP1028-BD-EV1 | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:43.5-46.5 GHz GaAs MMIC Power Amplifier |
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