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參數(shù)資料
| 型號： | XQ4010E-3BG191N |
| 廠商： | Xilinx, Inc. |
| 元件分類： | FPGA |
| 英文描述： | QPRO XQ4000E/EX QML High-Reliability FPGAs |
| 中文描述： | QPRO XQ4000E/EX QML第高可靠性的FPGA |
| 文件頁數(shù)： | 2/36頁 |
| 文件大小： | 304K |
| 代理商： | XQ4010E-3BG191N |
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R
XQ4000E Switching Characteristics
XQ4000E Absolute Maximum Ratings
(1)
Table 1:
XQ4000E/EX Field Programmable Gate Arrays
Device
Max.
Logic
Gates
(No RAM)
Max.
RAM Bits
(No
Logic)
Typical
Gate Range
(Logic and
RAM)
(1)
CLB
Matrix
Total
CLBs
Number
of
Flip-Flops
Max.
Decode
Inputs
per Side
Max.
User
I/O
Packages
XQ4005E
5,000
6,272
3,000 - 9,000
14 x 14
196
616
42
112
PG156,
CB164
XQ4010E
10,000
12,800
7,000 - 20,000
20 x 20
400
1,120
60
160
PG191,
CB196,
HQ208
XQ4013E
13,000
18,432
10,000 - 30,000
24 x 24
576
1,536
72
192
PG223,
CB228,
HQ240
XQ4025E
25,000
32,768
15,000 - 45,000
32 x 32
1,024
2,560
96
256
PG299,
CB228
XQ4028EX
28,000
32,768
18,000 - 50,000
32 x 32
1,024
2,560
96
256
PG299,
CB228,
HQ240,
BG352
Notes:
1.
Max values of Typical Gate Range include 20-30% of CLBs used as RAM.
Symbol
Description
Units
V
CC
V
IN
V
TS
T
STG
T
SOL
T
J
Supply voltage relative to GND
Input voltage relative to GND
(2)
Voltage applied to High-Z output
(2)
–
0.5 to +7.0
V
–
0.5 to V
CC
+ 0.5
–
0.5 to V
CC
+ 0.5
–
65 to +150
V
V
Storage temperature (ambient)
°
C
°
C
°
C
°
C
Maximum soldering temperature (10s @ 1/16 in. = 1.5 mm)
+260
Junction temperature
Ceramic package
+150
Plastic package
+125
Notes:
1.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
Maximum DC excursion above V
or below Ground must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During
transitions, the device pins may undershoot to
–
2.0V or overshoot to V
CC
+ 2.0V, provided this over or undershoot lasts less than
10 ns and with the forcing current being limited to 200 mA.
2.
相關PDF資料 |
PDF描述 |
|---|---|
| XQ4010E-3CB191M | QPRO XQ4000E/EX QML High-Reliability FPGAs |
| XQ4010E-3CB191N | QPRO XQ4000E/EX QML High-Reliability FPGAs |
| XQ4010E-3CB196M | QPRO XQ4000E/EX QML High-Reliability FPGAs |
| XQ4010E-3CB196N | QPRO XQ4000E/EX QML High-Reliability FPGAs |
| XQ4010E-3HQ191M | QPRO XQ4000E/EX QML High-Reliability FPGAs |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| XQ4010E-3BG196M | 制造商:XILINX 制造商全稱:XILINX 功能描述:QML High-Reliability FPGAs |
| XQ4010E-3BG196N | 制造商:XILINX 制造商全稱:XILINX 功能描述:QML High-Reliability FPGAs |
| XQ4010E-3CB191M | 制造商:XILINX 制造商全稱:XILINX 功能描述:QPRO XQ4000E/EX QML High-Reliability FPGAs |
| XQ4010E-3CB191N | 制造商:XILINX 制造商全稱:XILINX 功能描述:QPRO XQ4000E/EX QML High-Reliability FPGAs |
| XQ4010E-3CB196M | 制造商:XILINX 制造商全稱:XILINX 功能描述:QPRO XQ4000E/EX QML High-Reliability FPGAs |
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