參數(shù)資料
型號: XR1005
廠商: MIMIX BROADBAND INC
元件分類: 衰減器
英文描述: 19.0-26.0 GHz GaAs MMIC Receiver
中文描述: RF/MICROWAVE DOWN CONVERTER
封裝: DIE-10
文件頁數(shù): 5/9頁
文件大?。?/td> 356K
代理商: XR1005
Page 5 of 9
Mechanical Drawing
Bias Arrangement
Bypass Capacitors
- See App Note [2]
(Note: Engineering designator is 22REC0393)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC/IF Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 4.787 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd1)
Bond Pad #4 (Vd2)
Bond Pad #6 (Vg2b)
Bond Pad #3 (IF1)
Bond Pad #5 (LO)
Bond Pad #7 (Vg2)
Bond Pad #8 (Vg2a)
Bond Pad #9 (IF2)
Bond Pad #10 (Vg1)
RF
Vd1
IF1
LO
Vd2
IF2
Vg2
Vg1
XR1005
19.0-26.0 GHz GaAs MMIC
Receiver
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
April 2006 - Rev 10-Apr-06
R1005
1
2
3
4
5
6
7
8
1.608
(0.063)
1.945
(0.077)
1.678
(0.066)
2.478
(0.098)
3.278
(0.129)
3.970
(0.156)
1.488
(0.059)
3.677
(0.145)
3.278
(0.129)
10
1.678
(0.066)
9
2.478
(0.098)
3.077
(0.121)
0.0
0.0
1
2
3
4
5
6
7
8
10
9
Vg1
Vg2
IF2
LO
Vd2
IF1
Vd1
RF
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