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參數(shù)資料
| 型號： | XRA1402IL16-0B-EB |
| 廠商： | Exar Corporation |
| 文件頁數(shù)： | 8/14頁 |
| 文件大?。?/td> | 0K |
| 描述： | GPIO EXPANDER EVAL BOARD |
| 設計資源： | XRA140x Eval Board (8-Bit) Schematics |
| 標準包裝： | 1 |
| 主要目的： | 接口，GPIO 擴展器 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | XRA1402IL16 |
| 已供物品： | 板 |
| 其它名稱： | 1016-1743 XRA1402IL16-OB-EB |
XRA1402
3
REV. 1.0.0
8-BIT SPI GPIO EXPANDER
PIN DESCRIPTIONS
Pin Description
NAME
PIN#
TYPE
DESCRIPTION
SPI INTERFACE
SO
13
15
O
SPI serial data output.
SCL
12
14
I
SPI bus serial input clock.
IRQ#
11
13
OD
Interrupt output (open-drain, active LOW).
CS#
15
1
I
SPI bus chip select.
SI
16
2
I
SPI serial data input.
RESET#
1
3
I
Reset (active LOW) - A longer than 40 ns LOW pulse on this pin will reset the
internal registers and all GPIOs will be configured as inputs.
GPIOs
P0
P1
P2
P3
P4
P5
P6
P7
2
3
4
5
7
8
9
10
4
5
6
7
9
10
11
12
I/O
General purpose I/Os P0-P7. All GPIOs are configured as inputs upon power-
up or after a reset.
ANCILLARY SIGNALS
VCC
14
16
Pwr
1.65V to 3.6V VCC supply voltage.
GND
6
8
Pwr
Power supply common, ground.
GND
Center
Pad
-
Pwr
The exposed pad at the bottom surface of the package is designed for thermal
performance. Use of a center pad on the PCB is strongly recommended for ther-
mal conductivity as well as to provide mechanical stability of the package on the
PCB. The center pad is recommended to be solder masked defined with open-
ing size less than or equal to the exposed thermal pad on the package bottom to
prevent solder bridging to the outer leads of the device. Thermal vias must be
connected to GND plane as the thermal pad of package is at GND potential.
Pin type: I=Input, O=Output, I/O= Input/output, OD=Output Open Drain.
QFN-16 TSSOP-16
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| XRA1402IL16-F | 功能描述:接口-I/O擴展器 8 Bit SPI GPIO Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| XRA1402IL16TR-F | 功能描述:接口-I/O擴展器 8 Bit SPI GPIO Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| XRA1403IG24-0B-EB | 功能描述:其他開發(fā)工具 16 Bit SPI Eval GPIO Expander RoHS:否 制造商:Parallax 產品:ELEV-8 Hex Upgrade Kits 類型:Robotics 工具用于評估:ELEV-8 Quadcopter 工作電源電壓: |
| XRA1403IG24-F | 功能描述:接口-I/O擴展器 16 Bit SPI GPIO Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| XRA1403IG24TR-F | 功能描述:接口-I/O擴展器 16 Bit SPI GPIO Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
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