
Published Date : MAY 12,2008
Drawing No : XDSB1458
V4
Checked : B.L.LIU
P.1/4
Part Number:
XSM2BG883W
SUPER FLUX LED LAMP
PRELIMINARY SPEC
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ± 0.25(0.01") unless otherwise noted.
3. Specifications are subject to change without notice
.
Benefits:
*Outstanding Material Efficiency.
*Electricity savings.
*Maintenance savings.
*Reliable and Rugged.
Typical Applications:
*Automotive Exterior Lighting.
*Electronic Signs and Signals.
*Specialty Lighting.
Absolute maximum ratings
(TA=25°C)
M2BG
(InGaN)
Unit
Reverse Voltage
VR
5
V
Forward Current
IF
50
mA
Power Dissipation
PT
210
mW
Operating Temperature
TA
-40 ~ +85
Storage Temperature
Tstg
-55 ~ +85
Electrostatic Discharge Threshold (HBM)
1000
V
Lead Solder Temperature
[1.5mm(0.06inch)Below Seating Plane.]
260°C For 5 Seconds
°C
Operating Characteristics
(TA=25°C)
M2BG
(InGaN)
Unit
Forward Voltage (Typ.)
(IF=50mA)
VF
3.5
V
Forward Voltage (Max.)
(IF=50mA)
VF
4.2
V
Reverse Current (Max.)
(VR=5V)
IR
10
uA
Wavelength of Peak
Emission (Typ.)
(IF=50mA)
λ P
525
nm
Wavelength of Dominant
Emission (Typ.)
(IF=50mA)
λ D
535
nm
Spectral Line Full Width
At Half-Maximum (Typ.)
(IF=50mA)
Δλ
39
nm
Capacitance (Typ.)
(VF=0V, f=1MHz)
C
65
pF
Thermal Resistance (Typ.)
Rθj-pin
130
°
C/W
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Features:
●HIGH LUMINANCE OUTPUT.
●DESIGN FOR HIGH CURRENT OPERATION.
●UNIFORM COLOR.
●LOW POWER CONSUMPTION.
●LOW THERMAL RESISTANCE.
●LOW PROFILE.
●PACKAGED IN TUBES FOR USE WITH
AUTOMATIC INSERTION EQUIPMENT.
●SOLDERING METHODS: WAVE SOLDERING.
●RoHS COMPLIANT.
1.No Reflow soldering .