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OCT 24, 2006 revised to APR 10, 2007
Page 1 of 26
www.power-one.com
YNV12T100xy DC-DC Converter Family Data Sheet
9.6-14 VDC Input; 1.0 -5.0 VDC Output @ 10 A
Applications
Intermediate Bus Architectures
Telecommunications
Data communications
Servers, workstations
Distributed Power Architectures
Benefits
High efficiency – no heat sink required
Reduces total solution board area
The
Products: Y-Series
Features
RoHS lead-free solder and lead-solder-exempted
products are available
Delivers up to 10 A (50 W)
Industry-standard footprint and pinout
Single-in-Line Package (SIP): 2.0” x 0.535” x 0.28”
(50.8 x 13.59 x 7.11 mm)
Weight: 0.25 oz [7 g]
Synchronous Buck Converter topology
Start-up into pre-biased output
No minimum load required
Output voltage trim +/-10%
Operating ambient temperature: -40 °C to 85 °C
Remote output sense
Remote ON/OFF (positive or negative)
Fixed-frequency operation
Auto-reset output overcurrent protection
Auto-reset overtemperature protection
High reliability, MTBF = TBD Million Hours
All materials meet UL94, V-0 flammability rating
UL 60950 recognition in U.S. & Canada, and DEMKO
certification per IEC/EN 60950
Description
The YNV12T100xy family of non-isolated DC-DC converters deliver up to 10 A of output current in an
industry-standard through hole (SIP) package. The YNV12T100xy converters operate from a 9.6 –14 VDC
input, and are ideal choices for Intermediate Bus Architectures where point-of-load power delivery is generally
a requirement.
Within the YNV12T100xy family, converters come in individual output voltage versions, allowing coverage of
the output voltage range from 1.0 V to 5.0 V. Each version is capable of providing an extremely tight, highly
regulated, and trimmable output.
The YNV12T100xy converters provide exceptional thermal performance, even in high temperature
environments with minimal airflow. No derating is required for temperatures up to 70 °C under natural
convection conditions. This is accomplished through the use of circuitry, packaging, and processing
techniques to achieve ultra-high efficiency, excellent thermal management, and a very sleek body profile.
The sleek body profile and the preclusion of heat sinks minimize impedance to system airflow, thus enhancing
cooling for both upstream and downstream devices. The use of 100% automation for assembly, coupled with
advanced power electronics and thermal design, results in a product with extremely high reliability.