參數(shù)資料
型號(hào)： ZL40539LCF
廠商： ZARLINK SEMICONDUCTOR INC
元件分類： 其它接口
英文描述： Dual Output CD and DVD 4 Channel Laser Diode Driver
中文描述： SPECIALTY INTERFACE CIRCUIT, QCC32
封裝： 6 X 5 MM, 0.85 MM HEIGHT, MO-220VJHD, QFN-32
文件頁(yè)數(shù)： 3/26頁(yè)
文件大小： 538K
代理商： ZL40539LCF
ZL40539
Data Sheet
3
Zarlink Semiconductor Inc.
Application Notes
Read and Write Channel Operation
The device is activated by applying a 'High' signal to the Enable pin. In this mode, the read channel can be enabled
with a low signal on ENRB. The fast write channels can be enabled by applying a 'High' signal to the respective pair
of write enable pins (EN2P, EN2N), (EN3P, EN3N), or (EN4P, EN4N). The output currents of the four channels are
summed together and output as a composite signal at either OUTA (if SELA select is 'High') or OUTB (if SELA
select is 'Low'). This provides the ability to drive two different laser diodes with just one ZL40539.
Voltage control of the channel reference inputs (INR, IN2, IN3 and IN4) can be achieved quite easily using an
external resistor R
ref
in series with the reference channel input to convert a given reference potential V
ref
to an input
current, I
in
:
,
where R
in
is the input impedance of the respective reference channel.
On-chip RF Oscillator
An on-chip RF oscillator is enabled if OSCEN = 'High', and its output signal is added to the appropriate current
output (OUTA, if SELA select is 'High', or OUTB, if SELA select is 'Low'). The oscillator amplitude is set by an
external resistor from RSA or RSB to GND. Its frequency is set by an external resistor RFA or RFB to GND. RSA
and RFA are selected when SELA is ‘High’
The oscillator signal is summed with the programmed Write and Read levels before amplification to the output. The
oscillator signal has zero DC level and +I_pk to –I_pk signal swing. Consequently, if the programmed DC level from
the Write and Read Channels is less than the PK level programmed for the Oscillator, the combined signal will be
clipped on the negative cycle of the signal. This will increase the harmonic content of the output signal and reduce
the pk to pk amplitude output.
Thermal Considerations
Package thermal resistance is 40
°
C/W under the EIA/JESD51-3 compliant PCB test board condition.
Users should ensure that the junction temperature does not exceed 150
°
C. Thermal resistance from junction to
case and to ambient is very much dependent on how the IC is mounted onto the board, on the PCB layout and on
any heat extraction arrangements.
Power consumption and system ambient operating temperature limits should be noted and careful thermal gradient
calculations undertaken to ensure that the junction temperature never exceeds 150
°
C.
in
ref
ref
+
in
R
R
V
I
=
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