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參數(shù)資料
| 型號： | ZL60101MJD |
| 廠商： | Zarlink Semiconductor Inc. |
| 英文描述： | 12 x 2.7 Gbps Parallel Fiber Optic Link Transmitter and Receiver |
| 中文描述： | 12 × 2.7 Gbps的并行光纖鏈路發(fā)射器和接收器 |
| 文件頁數(shù)： | 14/20頁 |
| 文件大?。?/td> | 347K |
| 代理商： | ZL60101MJD |
ZL60101/2
Data Sheet
14
Zarlink Semiconductor Inc.
Thermal Characteristics
There are three options for heat sinks depending on the cooling needs. They are:
1. Direct application without any attached external heat sink
2. Use a generic heat sink specified by Zarlink
3. Use a customer designed external heat sink
In Figure 11 and Figure 12, the temperature rise and thermal resistance as a function of air velocity (free air velocity
at the top of the module) is shown for option 1 and 2. The thermal resistance is defined as the temperature
difference between the case temperature and ambient flowing air divided by the total heat dissipation of the
module.
Improved thermal properties can be achieved by using a larger heat sink especially if more height is available
(option 3). For this option, a more detailed discussion with Zarlink is recommended regarding heat sink design
attachment materials.
Figure 11 - Temperature Difference Between Ambient Flowing Air and Case at a Heat Dissipation
of 1.5 W
Figure 12 - Thermal Resistance, as a Function of Air Velocity (the airflow is along the shortest
side of the module)
For any other orientation, the thermal resistance is 75-100% of the values shown above.
Temperature rise at 1.5W
(Free stream air velocity)
0
4
8
12
16
20
0
1
2
3
4
Air velocity (m/s)
T
Option ZL6010*/ML
Option ZL6010*/MJ
Thermal resistance to air
(Free stream air velocity)
0
5
10
15
0
1
2
3
4
Air velocity (m/s)
T
(
Option ZL6010*/ML
Option ZL6010*/MJ
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ZL60102 | 12 x 2.7 Gbps Parallel Fiber Optic Link Transmitter and Receiver |
| ZL60102MJD | 12 x 2.7 Gbps Parallel Fiber Optic Link Transmitter and Receiver |
| ZL60212 | 880 nm High-Performance Single-chip DUPLEX |
| ZL60212TBD | 880 nm High-Performance Single-chip DUPLEX |
| ZL60212TDD | 880 nm High-Performance Single-chip DUPLEX |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ZL60101MLDC | 制造商:ZARLINK 制造商全稱:Zarlink Semiconductor Inc 功能描述:12 x 2.7 Gbps Parallel Fiber Optic Link Transmitter and Receiver |
| ZL60101MLDL | 制造商:TE Connectivity 功能描述:12x2.7G Parallel Optical Transmitter |
| ZL60102 | 制造商:ZARLINK 制造商全稱:Zarlink Semiconductor Inc 功能描述:12 x 2.7 Gbps Parallel Fiber Optic Link Transmitter and Receiver |
| ZL60102/MJD | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Optoelectronic |
| ZL60102/MKD | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Optoelectronic |
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