參數(shù)資料
型號: ZXTD3M832
文件頁數(shù): 2/6頁
文件大小: 135K
代理商: ZXTD3M832
ZXTD3M832
S E M IC O N D U C T O R S
ISSUE 1 - J UNE 2003
2
PARAMETER
J unction to Ambient
(a)(f)
J unction to Ambient
(b)(f)
J unction to Ambient
(b)(f)
J unction to Ambient
(d)(f)
J unction to Ambient
(d)(g)
J unction to Ambient
(e)(g)
SYMBOL
VALUE
UNIT
R
J A
83.3
C/W
R
J A
51
C/W
R
J A
125
C/W
R
J A
111
C/W
R
J A
73.5
C/W
R
J A
41.7
C/W
NOTES
(a) For a dual device surface mounted on
8
sq cm single sided 2oz copper on FR4 PCB, in still air conditions
with all exposed pads attached
.
The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(b) Measured at t 5 secs for a dual device surface mounted on
8
sq cm single sided 2oz copper on FR4 PCB, in still air conditions
with all
exposed pads attached
. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual
device.
(c) For a dual device surface mounted on
8
sq cm single sided 2oz copper FR4 PCB, in still air conditions
with minimal lead connections only.
(d) For a dual device surface mounted on 10 sq cm single sided 1oz copper FR4 PCB, in still air conditions
with all exposed pads attached
.
The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(e) For a dual device surface mounted on 85 sq cm single sided 2oz copper FR4 PCB, in still air conditions
with all exposed pads attached
.
The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(f) For dual device with one active die.
(g) For dual device with 2 active die running at equal power.
(h) Repetitive rating - pulse width limited by max junction temperature. Refer to Transient Thermal Impedance graph.
(i) The minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device as shown in the
package dimensions data. The thermal resistance for a dual device mounted on 1.5mm thick FR4 board using minimum copper of 1 oz weight,
1mm wide tracks and one half of the device active is Rth= 250°C/W giving a power rating of Ptot=500mW
THERMAL RESISTANCE
PARAMETER
SYMBOL
LIMIT
UNIT
Collector-Base Voltage
V
CBO
V
CEO
V
EBO
I
CM
I
C
I
B
P
D
-50
V
Collector-Emitter Voltage
-40
V
Emitter-Base Voltage
-7.5
V
Peak Pulse Current
Continuous Collector Current
(a) (f)
-4
A
-3
A
Base Current
Power Dissipation at TA=25°C
(a)(f)
Linear Derating Factor
Power Dissipation at TA=25°C
(b)(f)
Linear Derating Factor
Power Dissipation at TA=25°C
(c)(f)
Linear Derating Factor
Power Dissipation at TA=25°C
(d)(f)
Linear Derating Factor
Power Dissipation at TA=25°C
(d)(g)
Linear Derating Factor
Power Dissipation at TA=25°C
(e)(g)
Linear Derating Factor
-1000
mA
1.5
12
W
mW/ C
P
D
2.45
19.6
W
mW/ C
P
D
1
8
W
mW/ C
P
D
1.13
9
W
mW/ C
P
D
1.7
13.6
W
mW/ C
P
D
3
24
W
mW/ C
Operating & Storage Temperature Range
T
j
:T
stg
T
j
-55 to +150
C
J unction Temperature
150
C
ABSOLUTE MAXIMUM RATINGS
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