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參數(shù)資料
| 型號： | μPD703000 |
| 廠商： | NEC Corp. |
| 英文描述： | 16/32 Bit Single Chip Microcontrollers(16/32位單片微控制器) |
| 中文描述： | 16/32位單片機微控制器（16/32位單片微控制器） |
| 文件頁數(shù)： | 85/88頁 |
| 文件大?。?/td> | 614K |
| 代理商： | ΜPD703000 |
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85
μ
PD703000, 703001
15. RECOMMENDED SOLDERING CONDITIONS
Solder this product under the following recommended conditions.
For the details of the recommended soldering conditions, refer to Information Document
Semiconductor Device
Mounting Technology Manual
(C10535E)
.
For soldering methods and soldering conditions other than those recommended, consult NEC.
Table 15-1. Soldering Conditions of Surface Mount Type
μ
PD703000GC-xx-xxx-7EA :
μ
PD703001GC-xx-7EA
100-pin plastic QFP (fine pitch) (14
×
14 mm)
100-pin plastic QFP (fine pitch) (14
×
14 mm)
:
Soldering Method
Soldering Condition
Symbol of
Recommended Condition
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max.
IR35-107-2
(210
°
C min.), Number of times: 2 max., Number of days: 7
Note
(after that, prebaking is necessary at 125
°
C for 10 hours)
<Precaution>
Products other than in heat-resistance trays (such as those packaged
in a magazine, taping, or non-heat-resistance tray) cannot be baked
while they are in their package.
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (200
°
C min.),
VP15-107-2
Number of times: 2 max., Number of days: 7
Note
(after that, prebaking is
necessary at 125
°
C for 10 hours)
<Precaution>
Products other than in heat-resistance trays (such as those packaged
in a magazine, taping, or non-heat-resistance tray) cannot be baked
while they are in their package.
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per side of device)
–
Note
The number of days during which the product can be stored at 25
°
C, 65% RH max. after the dry pack
has been opened.
Caution
Do not use two or more soldering methods in combination (except partial heating).
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