參數(shù)資料
型號(hào)： μPD750106
廠商： NEC Corp.
英文描述： 4 Bit Single Chip Microcontrollers(4位單片微控制器)
中文描述： 4位單片微控制器（4位單片微控制器）
文件頁(yè)數(shù)： 70/80頁(yè)
文件大小： 352K
代理商： ΜPD750106
m
PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)
70
16. RECOMMENDED SOLDERING CONDITIONS
The
m
PD750104,
m
PD750106, and
m
PD750108 should be soldered and mounted under the conditions recom-
mended in the table below.
For detail of recommended soldering conditions, refer to the information document
SMD Surface Mount
Technology Manual
(C10535E).
For soldering methods and conditions other than those recommended below, contact our sales personnel.
Table 16-1. Surface Mounting Type Soldering Conditions
m
PD750104GB-
￥￥￥
-3BS-MTX
m
PD750106GB-
￥￥￥
-3BS-MTX
m
PD750108GB-
￥￥￥
-3BS-MTX
m
PD750104GB(A)-
￥￥￥
-3BS-MTX : 44-pin plastic QFP (10
￥
10 mm, 0.8-mm pitch)
m
PD750106GB(A)-
￥￥￥
-3BS-MTX : 44-pin plastic QFP (10
￥
10 mm, 0.8-mm pitch)
m
PD750108GB(A)-
￥￥￥
-3BS-MTX : 44-pin plastic QFP (10
￥
10 mm, 0.8-mm pitch)
: 44-pin plastic QFP (10
￥
10 mm, 0.8-mm pitch)
: 44-pin plastic QFP (10
￥
10 mm, 0.8-mm pitch)
: 44-pin plastic QFP (10
￥
10 mm, 0.8-mm pitch)
Caution Use of more than one soldering method should be avoided (except for partial heating method).
Table 16-2. Insertion Type Soldering Conditions
m
PD750104CU-
￥￥￥
m
PD750106CU-
￥￥￥
m
PD750108CU-
￥￥￥
m
PD750104CU(A)-
￥￥￥
: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
m
PD750106CU(A)-
￥￥￥
: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
m
PD750108CU(A)-
￥￥￥
: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
Package peak temperature: 235 °C
Duration: 30 seconds max. (at 210 °C or above)
Maximum allowable number of reflow processes: 3
Package peak temperature: 215 °C
Duration: 40 seconds max. (at 200 °C or above)
Maximum allowable number of reflow processes: 3
Solder bath temperature: 260 °C max.
Duration: 10 seconds max.
Number of times: 1
Preliminary heat temperature: 120 °C max. (package surface temperature)
Terminal temperature: 300 °C max.
Duration: 3 seconds max. (per device side)
IR35-00-3
VP15-00-3
WS60-00-1
-
Infrared reflow
VPS
Wave
soldering
Partial heating
method
Soldering
method
Soldering conditions
Soldering method
Soldering conditions
Wave soldering (terminal only)
Partial heating method
Solder bath temperature: 260 °C max., Duration: 10 seconds max.
Terminal temperature: 300 °C max., Duration: 3 seconds max. (for each pin)
Caution Apply wave soldering to terminals only. See to it that the jet solder does not contact with the
chip directly.
Symbol
相關(guān)PDF資料
PDF描述
μPD750106(A) 4 Bit Single Chip Microcontrollers(4位單片微控制器)
μPD750108(A) 4 Bit Single Chip Microcontrollers(4位單片微控制器)
μPD750104 4Bit Single Chip Microcontrollers(4 位微控制器)
μPD750108 4Bit Single Chip Microcontrollers(4 位微控制器)
μPD753012A 4 Bit Single Chip Microcontrollers(4 位單片微控制器)
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