參數(shù)資料
型號： μPD753012A
廠商： NEC Corp.
英文描述： 4 Bit Single Chip Microcontrollers(4 位單片微控制器)
中文描述： 4位單片微控制器（4位單片微控制器）
文件頁數(shù)： 70/80頁
文件大小： 433K
代理商： ΜPD753012A
70
m
PD753012A, 753016A, 753017A
14. RECOMMENDED SOLDERING CONDITIONS
Solder the
m
PD753017A under the following recommended conditions.
For the details on the recommended soldering conditions, refer to Information Document
Semiconductor
Device Mounting Technology Manual (C10535E)
.
For the soldering methods and conditions other than those recommended, consult NEC.
Table 14-1. Soldering Conditions of Surface Mount Type
(1)
m
PD753012AGC-XXX-3B9: 80-pin plastic QFP (14
￥
14 mm)
m
PD753016AGC-XXX-3B9: 80-pin plastic QFP (14
￥
14 mm)
m
PD753017AGC-XXX-3B9: 80-pin plastic QFP (14
￥
14 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Reflow time: 30 seconds or below
(210
°
C or higher), Number of reflow processes: 3 max.
IR35-00-3
VPS
Package peak temperature: 215
°
C, Reflow time: 40 seconds or below
(200
°
C or higher), Number of reflow processes: 3 max.
VP15-00-3
Wave soldering
Solder temperature: 260
°
C or below, Time: 10 seconds or below,
Number of flow processes: 1
WS60-00-1
Preheating temperature: 120
°
C or below (package surface temperature)
Pin partial heating
Pin temperature: 300
°
C or below, Time: 3 seconds or below
(per side of device)
–
(2)
m
PD753012AGK-XXX-BE9: 80-pin plastic TQFP (fine pitch) (12
￥
12 mm)
m
PD753016AGK-XXX-BE9: 80-pin plastic TQFP (fine pitch) (12
￥
12 mm)
m
PD753017AGK-XXX-BE9: 80-pin plastic TQFP (fine pitch) (12
￥
12 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Reflow time: 30 seconds or below
(210
°
C or higher), Number of reflow processes: 3 max., Exposure limit:
7 days
Note
(After that, prebaking is necessary at 125
°
C for 10 hours.)
IR35-107-3
VPS
Package peak temperature: 215
°
C, Reflow time: 40 seconds or below
(200
°
C or higher), Number of reflow processes: 3 max., Exposure limit:
7 days
Note
(After that, prebaking is necessary at 125
°
C for 10 hours.)
VP15-107-3
Wave soldering
Solder temperature: 260
°
C or below, Flow time: 10 seconds or below,
Number of flow processes: 1
WS60-107-1
Preheating temperature: 120
°
C or below (package surface temperature)
Exposure limit: 7 days
Note
(After that, prebaking is necessary at 125
°
C for
10 hours.)
Pin partial heating
Pin temperature: 300
°
C or below, Time: 3 seconds or below
(per side of device)
–
Note
The number of days for storage after the dry pack has been opened. The storage conditions are
25
°
C, 65% RH max.
Caution Do not use two or more soldering methods in combination (except the pin partial heating
method).
相關(guān)PDF資料
PDF描述
μPD753016A 4 Bit Single Chip Microcontrollers(4 位單片微控制器)
μPD753017A 4 Bit Single Chip Microcontrollers(4 位單片微控制器)
μPD753012 8 Bit Single Chip Microcontrollers(8位單片微控制器)
μPD753016 8 Bit Single Chip Microcontrollers(8位單片微控制器)
μPD753017 8 Bit Single Chip Microcontrollers(8位單片微控制器)
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