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參數(shù)資料
| 型號： | μPD780308Y |
| 廠商： | NEC Corp. |
| 英文描述： | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| 中文描述： | 8位單片機(jī)微控制器（8位單片微控制器） |
| 文件頁數(shù)： | 62/72頁 |
| 文件大?。?/td> | 531K |
| 代理商： | ΜPD780308Y |
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62
μ
PD780306Y, 780308Y
13. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD780306Y and 780308Y should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact our sales personnel.
Table 13-1. Surface Mounting Type Soldering Conditions
(1)
μ
PD780306YGF-
×××
-3BA: 100-pin plastic QFP (14
×
20 mm)
μ
PD780308YGF-
×××
-3BA: 100-pin plastic QFP (14
×
20 mm)
Soldering Method
Soldering Conditions
Recommended
Soldering Symbols
Infrared reflow
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Three times max.
IR35-00-3
VPS
Package peak temperature: 215
°
C, Duration: 40 sec. (at 200
°
C or above),
Number of times: Three times max.
VP15-00-3
Wave soldering
Solder bath temperature: 260
°
C max., Duration: 10 sec. max., Number of times:
Once, Preheating temperature: 120
°
C max. (Package surface temperature)
Pin temperature: 300
°
C max., Duration: 3 sec. max. (per device side)
WS60-00-1
Partial heating
—
(2)
μ
PD780306YGC-
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14 mm)
μ
PD780308YGC-
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14 mm)
Soldering Method
Soldering Conditions
Recommended
Soldering Symbols
Infrared reflow
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Twice max.
IR35-00-2
VPS
Package peak temperature: 215
°
C, Duration: 40 sec. (at 200
°
C or above),
Number of times: Twice max.
VP15-00-2
Partial heating
Pin temperature: 300
°
C max., Duration: 3 sec. max. (per device side)
—
Caution Use of more than one soldering method should be avoided (except in the case of partial heating).
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