參數(shù)資料
型號: μPD78053
廠商: NEC Corp.
英文描述: 8 Bit Single Chip Microcontrollers(8位單片微控制器)
中文描述: 8位單片機(jī)微控制器(8位單片微控制器)
文件頁數(shù): 70/78頁
文件大小: 597K
代理商: ΜPD78053
70
μ
PD78052, 78053, 78054, 78055, 78056, 78058
Soldering
Method
Recommended
Condition Symbol
Soldering Conditions
Infrared reflow
IR35-107-3
VPS
VP15-107-3
Partial Heating
Table 14-1. Surface Mounting Type Soldering Conditions (2/2)
(2)
μ
PD78052GK-
×××
-BE9 :
μ
PD78053GK-
×××
-BE9 :
μ
PD78054GK-
×××
-BE9 :
μ
PD78055GK-
×××
-BE9 :
μ
PD78056GK-
×××
-BE9 :
μ
PD78058GK-
×××
-BE9 :
80-pin plastic TQFP (12
×
12 mm)
80-pin plastic TQFP (12
×
12 mm)
80-pin plastic TQFP (12
×
12 mm)
80-pin plastic TQFP (12
×
12 mm)
80-pin plastic TQFP (12
×
12 mm)
80-pin plastic TQFP (12
×
12 mm)
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Thrice max., Time limit: 7 days
Note
(thereafter 10 hours 125
°
C
prebaking required)
<Precautions>
Baking cannot be applied to other than heat-resistant trays (magazine, taping, non-
heat-resistant trays) when the product is wrapped.
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above),
Number of times: Thrice max., Time limit: 7 days
Note
(thereafter 10 hours 125
°
C
prebaking required)
<Precautions>
Baking cannot be applied to other than heat-resistant trays (magazine, taping, non-
heat-resistant trays) when the product is wrapped.
Pin temperature: 300
°
C max. Duration: 3 sec. max. (per device side)
Note
For the storage period after dry-pack decompression storage conditions are max. 25
°
C, 65% RH.
Caution
Use of more than one soldering method should be avoided (except in the case of partial heating).
相關(guān)PDF資料
PDF描述
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