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| 型號(hào)： | μPD78058FY |
| 廠商： | NEC Corp. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8 Bit Single Chip Microcontrollers |
| 中文描述： | 8位單片機(jī)微控制器 |
| 文件頁(yè)數(shù)： | 66/76頁(yè) |
| 文件大小： | 583K |
| 代理商： | ΜPD78058FY |
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66
μ
PD78056FY, 78058FY
13. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document
Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Table 13-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
μ
PD78056FYGC-
×××
-3B9 :
μ
PD78058FYGC-
×××
-3B9 :
80-pin plastic QFP (14
×
14 mm, resin thickness 2.7 mm)
80-pin plastic QFP (14
×
14 mm, resin thickness 2.7 mm)
IR35-00-3
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Three times max.
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above),
Number of times: Three times max.
Solder bath temperature : 260
°
C max., Duration : 10 sec. max., Number of times:
once, Preheating temperature : 120
°
C max. (package surface temperature)
Pin temperature: 300
°
C max. Duration: 3 sec. max. (per pin row)
Soldering Conditions
Soldering
Method
Infrared reflow
Recommended
Condition Symbol
VPS
Wave soldering
Partial heating
VP15-00-3
WS60-00-1
—
Caution
Use of more than one soldering method should be avoided (except in the case of partial
heating).
IR35-00-2
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Twice max.
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above),
Number of times: Twice max.
Solder bath temperature : 260
°
C max., Duration : 10 sec. max., Number of times:
once, Preheating temperature : 120
°
C max. (package surface temperature)
Pin temperature: 300
°
C max. Duration: 3 sec. max. (per pin row)
Soldering Conditions
Soldering
Method
Infrared reflow
Recommended
Condition Symbol
VPS
Wave soldering
Partial heating
VP15-00-2
WS60-00-1
—
Caution
Use of more than one soldering method should be avoided (except in the case of partial
heating).
(2)
μ
PD78056FYGC-
×××
-8BT :
μ
PD78058FYGC-
×××
-8BT :
80-pin plastic QFP (14
×
14 mm, resin thickness 1.4 mm)
80-pin plastic QFP (14
×
14 mm, resin thickness 1.4 mm)
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