參數(shù)資料
型號： μPD78058FY
廠商： NEC Corp.
元件分類： 8位微控制器
英文描述： 8 Bit Single Chip Microcontrollers
中文描述： 8位單片機微控制器
文件頁數(shù)： 67/76頁
文件大小： 583K
代理商： ΜPD78058FY
67
μ
PD78056FY, 78058FY
Table 13-1. Surface Mounting Type Soldering Conditions (2/2)
(3)
μ
PD78058FYGK-
×××
-BE9:
80-pin plastic QFP (fine pitch) (12
×
12 mm)
Infrared reflow
VPS
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Three times max., Time limit: 7 days
Note
(thereafter 10 hours 125
°
C
prebaking required)
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above),
Number of times: Three times max., Time limit: 7 days
Note
(thereafter 10 hours 125
°
C
prebaking required)
Solder bath temperature: 260
°
C max., Duration:10 sec. max., Number of times: once,
Preheating temperature: 120
°
C max. (package surface tempeature). Time limit: 7
days
Note
(therefore 10 hours 125
°
C prebaking required)
Pin temperature: 300
°
C max. Duration: 3 sec. max. (per pin row)
Soldering Conditions
Soldering
Method
Recommended
Condition Symbol
IR35-107-3
Wave Soldering
Partial Heating
VP15-107-3
WS60-107-1
—
Note
For the storage period after dry-pack decompression storage conditions are max. 25
°
C, 65 % RH.
Caution
Use of more than one soldering method should be avoided (except in the case of partial heating).
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