參數資料
型號: μPD78058Y
廠商: NEC Corp.
英文描述: 8Bit Single Chip Microcontrollers(8位單片微控制器)
中文描述: 8位單芯片微控制器(8位單片微控制器)
文件頁數: 67/74頁
文件大?。?/td> 574K
代理商: ΜPD78058Y
67
μ
PD78052Y, 78053Y, 78054Y, 78055Y, 78056Y, 78058Y
14. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended in the table below.
For a detailed description of recommended soldering conditions, refer to the information document
Semiconduc-
tor Device Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Table 14-1. Surface Mounting Type Soldering Conditions
μ
PD78052YGC-xxx-8BT : 80-pin plastic QFP (14
×
14 mm)
μ
PD78053YGC-xxx-8BT : 80-pin plastic QFP (14
×
14 mm)
μ
PD78054YGC-xxx-8BT : 80-pin plastic QFP (14
×
14 mm)
μ
PD78055YGC-xxx-8BT : 80-pin plastic QFP (14
×
14 mm)
μ
PD78056YGC-xxx-8BT : 80-pin plastic QFP (14
×
14 mm)
μ
PD78058YGC-xxx-8BT : 80-pin plastic QFP (14
×
14 mm)
Infrared reflow
VPS
Wave soldering
Partial heating
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Twice max.
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above),
Number of times: Twice max.
Solder bath temperature : 260
°
C max., Duration : 10 sec. max., Number of times:
once, Preheating temperature : 120
°
C max. (package surface temperature)
Pin temperature: 300
°
C max. Duration: 3 sec. max. (per pin row)
Soldering Conditions
Soldering Method
IR35-00-2
VP15-00-2
WS60-00-1
Recommended
Condition Symbol
Caution
Avoid as much as possible combining two or more soldering methods (except for the partial
heating method).
相關PDF資料
PDF描述
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