10
μ
PD78P054, 78P058
CONTENTS
1. DIFFERENCES BETWEEN
μ
PD78P054, 78P058 AND MASK ROM VERSIONS.........................11
2. PIN FUNCTIONS ................................................................................................................................12
2.1
Pins in Normal Operating Mode.............................................................................................................. 12
2.2
Pins in PROM Programming Mode ......................................................................................................... 15
2.3
Pin Input/Output Circuits and Recommended Connection of Unused Pins .................................... 16
3. MEMORY SIZE SWITCHING REGISTER (IMS)...............................................................................20
4. INTERNAL EXPANSION RAM SIZE SWITCHING REGISTER (IXS) (
μ
PD78P058 ONLY) ..........22
5. PROM PROGRAMMING ....................................................................................................................23
5.1
Operating Modes ....................................................................................................................................... 23
5.2
PROM Write Procedure ............................................................................................................................ 25
5.3
PROM Read Procedure............................................................................................................................. 29
6. ERASURE METHOD (
μ
PD78P054KK-T, 78P058KK-T ONLY).......................................................30
7. ERASURE WINDOW OPAQUE FILM (
μ
PD78P054KK-T, 78P058KK-T ONLY)............................30
8. SCREENING OF ONE-TIME PROM VERSIONS..............................................................................30
9. ELECTRICAL SPECIFICATIONS......................................................................................................31
10. CHARACTERISTIC CURVES (FOR REFERENCE ONLY) .............................................................65
11. PACKAGE DRAWINGS .....................................................................................................................69
12. RECOMMENDED SOLDERING CONDITIONS ................................................................................73
APPENDIX A. DEVELOPMENT TOOLS.................................................................................................75
APPENDIX B. RELATED DOCUMENTS ................................................................................................81