- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄382790 > μPD78P054 (NEC Corp.) 8 Bit Single Chip Microcontrollers PDF資料下載
參數(shù)資料
| 型號(hào)： | μPD78P054 |
| 廠商： | NEC Corp. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8 Bit Single Chip Microcontrollers |
| 中文描述： | 8位單片機(jī)微控制器 |
| 文件頁數(shù)： | 73/86頁 |
| 文件大?。?/td> | 502K |
| 代理商： | ΜPD78P054 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁當(dāng)前第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁
73
μ
PD78P054, 78P058
12. RECOMMENDED SOLDERING CONDITIONS
These products should be soldered and mounted under the conditions recommended below.
For details of recommended soldering conditions, refer to the information document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended, please contact your NEC sales represen-
tative.
Table 12-1. Surface Mount Type Soldering Conditions (1/2)
(1)
μ
PD78P054GC-3B9 : 80-pin plastic QFP (14
×
14 mm, resin thickness: 2.7 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
IR35-00-3
VPS
VP15-00-3
Wave soldering
WS60-00-1
Pin partial heating
—
Package peak temperature: 235
°
C, Reflow time: 30 seconds or below (210
°
C or
higher), Number of reflow processes: 3 max.
Package peak temperature: 215
°
C, Reflow time: 40 seconds or below (200
°
C or
higher), Number of reflow processes: 3 max.
Solder temperature: 260
°
C or below, Flow time: 10 seconds or below, Number of
flow processes: 1, Preheating temperature: 120
°
C or below (package surface
temperature)
Pin temperature: 300
°
C or below, Time: 3 seconds or below (per side of device)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
IR35-107-3
VPS
VP15-107-3
Pin partial heating
—
Package peak temperature: 235
°
C, Reflow time: 30 seconds or below (210
°
C or
higher), Number of reflow processes: 3 max., Exposure limit: 7 days
Note
(after that,
prebaking is necessary at 125
°
C for 10 hours)
Package peak temperature: 215
°
C, Reflow time: 40 seconds or below (200
°
C or
higher), Number of reflow processes: 3 max., Exposure limit: 7 days
Note
(after that,
prebaking is necessary at 125
°
C for 10 hours)
Pin temperature: 300
°
C or below, Time: 3 seconds or below (per side of device)
(2)
μ
PD78P054GK-BE9 : 80-pin plastic TQFP (fine pitch) (12
×
12 mm)
Note
The number of days for storage after the dry pack has been opened. Storage conditions are 25
°
C and 65%
RH max.
Cautions 1. Use of more than one soldering method should be avoided (except in the case of pin partial
heating method).
2. Because the
μ
PD78P054GC-8BT is under development, soldering conditions are not deter-
mined.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| μPD78P058 | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| μPD78P058FY | 8 Bit Single Chip Microcontrollers |
| μPD78P058Y | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| μPD78P064B | 8 Bit Single Chip Microcontrollers |
| μPD78P064B(A) | 8 Bit Single Chip Microcontrollers |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PD7935 | 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:FOR OPTICAL COMMUNICATION |
| PD7937 | 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:InGaAs PIN PHOTO DIODES |
| PD793D26 | 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:InGaAs PIN PHOTO DIODES |
| PD793D7 | 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:InGaAs PIN PHOTO DIODES |
| PD79920-0M | 制造商:Citizen Systems America Corporation 功能描述:Mobile Printer - PD24 USB Cable |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。