參數(shù)資料
型號(hào)： μPD78P9014
廠商： NEC Corp.
英文描述： 8 Bit Single Chip Microcontrollers(8位單片微控制器)
中文描述： 8位單片機(jī)微控制器（8位單片微控制器）
文件頁(yè)數(shù)： 42/48頁(yè)
文件大?。?/td> 191K
代理商： ΜPD78P9014
μ
PD78P9014
42
11. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD78P9014 should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document
Semiconductor Device
Mounting Technology Manual
(C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Table 11-1. Soldering Conditions for Surface-mount Devices
μ
PD78P9014GT: 28-pin Plastic SOP (375 mils)
Recommended
Condition Code
Soldering Method
Soldering Conditions
Infrared reflow
Package peak temperature: 235
°
C, Duration: 30 seconds max. (at 210
°
C or above)
Number of times: two times max., Limit on the number of days: 7 days
Note
(Later,
prebaking at 125
°
C for 20 hours is required.)
Attention
Articles other than a heat-resistant tray (magazine, taping, non-heat-resistant tray)
cannot be baked in the packed state.
VPS
Package peak temperature: 215
°
C, Duration: 40 seconds max. (at 200
°
C or above)
Number of times: two times max., Limit on the number of days: 7 days
Note
(Later,
prebaking at 125
°
C for 20 hours is required.)
Wave soldering
Soldering bath temperature: 260
°
C max., Duration: 10 seconds max., Number of
times: Once
Preheating temperature: 120
°
C max.(Package surface temperature)
Limit on the number of days: 7 days
Note
(Later, prebaking at 125
°
C for 20 hours is
required.)
Partial heating
Pin temperature: 300
°
C max., Duration: 3 seconds max. (per device side)
Note
The storage conditions are 25
°
C and 65% RH for the number of storage days after opening the seal of the
dry pack.
Caution Using more than one soldering method should be avoided. (except in the case of partial heating)
Table 11-2. Soldering Conditions for Through-hole Devices
μ
PD78P9014CT: 28-pin Plastic Shrink DIP (400 mils)
Soldering Method
Soldering Conditions
Wave soldering (pin only)
Solder bath temperature: 260
°
C max., Duration: 10 seconds max.
Partial heating
Pin temperature: 300
°
C max., Duration: 3 seconds max.(per pin)
Caution Wave soldering is only for the lead part in order that jet solder cannot contact with the chip
directly.
IR35-207-2
VP15-207-2
WS60-207-1
–
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