參數(shù)資料
型號: 0603LGCT
廠商: 赫備國際貿(mào)易(上海)有限公司
英文描述: SURFACE MOUNT DEVICE LED
中文描述: 表面貼裝器件的LED
文件頁數(shù): 10/10頁
文件大?。?/td> 791K
代理商: 0603LGCT
SURFACE MOUNT DEVICE LED
Part No. :
0603LGCT
REV:A / 0
1
Wave soldering :
Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max.
preformed consecutively cooling process is required between 1st and 2nd soldering processes.
4. Lead-Free Soldering
For Reflow Soldering :
1、Pre-Heat Temp:150-180℃,120sec.Max.
2、Soldering Temp:Temperature Of Soldering Pot Over 230℃,40sec.Max.
3、Peak Temperature:260℃,5sec.
4、Reflow Repetition:2 Times Max.
5、Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 B /0.5 Cu
For Soldering Iron (Not Recommended) :
1、Iron Tip Temp:350℃ Max.
2、Soldering Iron:30w Max.
3、Soldering Time:3 Sec. Max. One Time.
For Dip Soldering :
1、Pre-Heat Temp:150℃ Max. 120 Sec. Max.
2、Bath Temp:265℃ Max.
3、Dip Time:5 Sec. Max.
DRAWING NO. : DS-74-03-0008
DATE : 2004-06-07
PAGE
9 of 10
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