參數(shù)資料
型號: 085CS
廠商: Vishay Intertechnology,Inc.
英文描述: Aluminum Capacitors SMD (Chip) Standard
中文描述: 表面貼裝鋁電容器(芯片)標(biāo)準(zhǔn)
文件頁數(shù): 2/6頁
文件大?。?/td> 159K
代理商: 085CS
www.vishay.com
For technical questions contact: aluminumcaps1@vishay.com
Document Number: 28300
2
Revision: 22-Sep-03
085 CS
Vishay BCcomponents
Aluminum Capacitors
SMD (Chip) Standard
DIMENSIONS in millimeters
7.5
9 max
2.7
max
2 max
3.9
max
4.1
max
2 max
3.9
max
2.7
max
Fig.2 Dimensional outlines.
a. Case size 8.8 × 3.7 × 3.9 mm.
10.8
12.2 max
2.7
max
2 max
3.9
max
4.1
max
2 max
3.9
max
2.7
max
a.
b.
b. Case size 11.9 x 3.7 x 3.9 mm.
PACKAGING
Tape on reel packaging: 2000 per reel.
Detailed tape dimensions see section ‘PACKAGING’.
MOUNTING
The capacitors are designed for automatic placement on
printed-circuit boards or hybrid circuits.
Optimum dimensions of soldering pads depend upon
soldering method, mounting accuracy, print lay-out and/or
adjacent components.
For recommended pad dimensions, refer to Fig. 3
and Table 2.
Table 2
RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters (placement accuracy ±0.25mm)
NOMINAL CASE SIZE
L ×
×
× W ×
×
× H
FOR REFLOW SOLDERING
FOR WAVE SOLDERING
ABCD
E
F
G
ABCD
E
F
G
8.8 × 3.7 × 3.9
9.7
3.5
2.9
2.5
3.0
10.1
4.4
13.5
4.1
4.7
3.7
2.9
14.0
8.4
11.9 × 3.7 × 3.9
12.9
6.5
2.9
2.5
6.0
13.3
4.4
16.8
7.4
4.7
3.7
6.1
17.3
8.4
solder land/
solder paste
pattern
solder resist
pattern
occupied
area
tracks or
dummy tracks
E
D
G
C
B
A
F
E
D
G
C
B
A
F
reflow soldering
wave soldering
Fig.3 Recommended pad dimensions for reflow and wave soldering.
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