參數(shù)資料
型號(hào)： 085CS
廠商： Vishay Intertechnology,Inc.
英文描述： Aluminum Capacitors SMD (Chip) Standard
中文描述： 表面貼裝鋁電容器（芯片）標(biāo)準(zhǔn)
文件頁(yè)數(shù)： 3/6頁(yè)
文件大?。?/td> 159K
代理商： 085CS
Document Number: 28300
For technical questions contact: aluminumcaps1@vishay.com
www.vishay.com
Revision: 22-Sep-03
3
085 CS
Aluminum Capacitors
SMD (Chip) Standard
Vishay BCcomponents
b
a
d
+
++
c
flow-direction of solder
Fig.4 Minimum distances between 085 CS capacitors on a printed-circuit board for wave soldering.
For dimensions a, b, c and d, refer to Table 3 .
Flow direction of solder preferably onto side-walls or plus-side of the capacitors.
SOLDERING
Soldering conditions are defined by the curve, temperature
versus time. The temperature is that measured on the
soldering pad during processing.
For maximum conditions of different soldering methods see
Figs 5, 6 and 7.
Any temperature/time curve which does not exceed the
specified maximum curves may be applied.
AS A GENERAL PRINCIPLE, TEMPERATURE AND
DURATION SHALL BE THE MINIMUM NECESSARY
REQUIRED
TO
ENSURE
GOOD
SOLDERING
CONNECTIONS.
Table 3
MINIMUM DISTANCES BETWEEN
CAPACITORS in millimeters
NOMINAL CASE
SIZE
L ×
×
× W ×
×
× H
CASE
CODE
amin
bmin
cmin
dmin
8.8 × 3.7 × 3.9
1a
12
6.8
11.9 × 3.7 × 3.9
1
15
6.8
Table 4
CURING CONDITIONS FOR SMD-GLUE
MAX. Tamb
(°°°°C)
MAX. EXPOSURE TIME
(minutes)
125
10
140
3
150
1
160
0.5
250
280
80
050
200
180
150
100
200
220
240
260
160
140
120
100
T
PAD
( C)
o
t (s)
Fig.5
Maximum temperature load
during infrared reflow soldering.
250
280
80
050
200
180
150
100
200
220
240
260
160
140
120
100
T
PAD
( C)
o
t (s)
Fig.6
Maximum temperature load during
vapour phase reflow soldering.
250
280
80
050
200
180
150
100
200
220
240
260
160
140
120
100
T
PAD
( C)
o
t (s)
Fig.7
Maximum temperature load during
(double-) wave soldering.
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